Evidence map›Paper›PMID 42230561›Full record

ArticleLight, science & applications2026

Thermal Utilization on Chip.

Yaohao Zhang, Bo Lai, Fei Yu, Xuesong Li, Yue Yang, Wei Lü, Ke Jiang, Xiaojuan Sun, Dabing Li

Abstract read
In one paragraph

Article in Light, science & applications, 2026. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Not yet cited in PubMed.

0numbers the graph read from it
0cells of the map it votes in
0citing papers in PubMed
–field-weighted citation impact
1 · What the graph read from it

What it found

Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.

The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.

2 · The registry

The trial behind it

Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.

Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.

3 · Its place in the literature

Who cites it

0 citing papers in PubMed.

No citing paper in PubMed yet.

4 · The record

Corrections and comments

PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.

5 · Who and what money

Authors and funding

9 authors.

Yaohao Zhang *State Key Laboratory of Luminescence Science and Technology, Changchun Institute of Optics, Fine Mechanics and Physics, Chinese Academy of Sciences, Changchun, China.
Bo Lai *State Key Laboratory of Luminescence Science and Technology, Changchun Institute of Optics, Fine Mechanics and Physics, Chinese Academy of Sciences, Changchun, China.
Fei YuKey Laboratory of Advanced Structural Materials, Ministry of Education and School of Materials Science and Engineering and Advanced Institute of Materials Science, Changchun University of Technology, Changchun, China.
Xuesong LiKey Laboratory of Advanced Structural Materials, Ministry of Education and School of Materials Science and Engineering and Advanced Institute of Materials Science, Changchun University of Technology, Changchun, China.
Yue YangKey Laboratory of Advanced Structural Materials, Ministry of Education and School of Materials Science and Engineering and Advanced Institute of Materials Science, Changchun University of Technology, Changchun, China.
Wei LüState Key Laboratory of Luminescence Science and Technology, Changchun Institute of Optics, Fine Mechanics and Physics, Chinese Academy of Sciences, Changchun, China. lw771119@hotmail.com.
Ke JiangState Key Laboratory of Luminescence Science and Technology, Changchun Institute of Optics, Fine Mechanics and Physics, Chinese Academy of Sciences, Changchun, China.
Xiaojuan SunState Key Laboratory of Luminescence Science and Technology, Changchun Institute of Optics, Fine Mechanics and Physics, Chinese Academy of Sciences, Changchun, China. sunxj@ciomp.ac.cn.
Dabing LiState Key Laboratory of Luminescence Science and Technology, Changchun Institute of Optics, Fine Mechanics and Physics, Chinese Academy of Sciences, Changchun, China. lidb@ciomp.ac.cn.ORCID http://orcid.org/0000-0001-5353-1460

Funding

National Natural Science Foundation of China (National Science Foundation of China) 62121005National Natural Science Foundation of China (National Science Foundation of China) 62425408National Natural Science Foundation of China (National Science Foundation of China) 62474024Youth Innovation Promotion Association of the Chinese Academy of Sciences (Youth Innovation Promotion Association CAS) 2023223
6 · The paper itself

Abstract

The integration and miniaturization of chips lead to significant power consumption and heat accumulation. Typically, the energy consumption of cooling systems accounts for morn than 50% of the input energy. Current thermal management technologies do not offer solutions for on-chip thermal energy loss. Herein, we propose an on-chip integrated thermal recovery system, which can simultaneously achieve efficient heat dissipation. Present system on chips is based on hydrovoltaic generator technology, consisting of electrodes and gel. With the deep ultraviolet LED (236 nm) chip suffering from severe heat accumulation as a prototype, upon integration with the thermal recovery system, not only maintain the chip temperature below 40 °C, but also converts waste heat into stored electrical energy, resulting in a 610.70% improvement in overall energy utilization efficiency. To demonstrate its general applicability in commercial CPU systems, we used the commercial Intel G3220 chip and as an example, by incorporating four HEG units, the temperature was reduced from 93 °C to below 60 °C, effectively enhancing computational performance and extending the chip's lifespan.

Identifiers

PMID42230561
PMCPMC13230715

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Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.