Evidence map›Paper›PMID 42203869›Full record

ArticleNature2026

Monolithic three-dimensional integration of silicon transistors.

Bao Lam, Yung Man Yu, Hyunjun Nam, Hsu-Chih Ni, Shomik Chatterjee, Shaloo Rakheja, Jian-Min Zuo, Qing Cao

Abstract read
PubMed Publisher
In one paragraph

Article in Nature, 2026. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Not yet cited in PubMed.

0numbers the graph read from it
0cells of the map it votes in
0citing papers in PubMed
–field-weighted citation impact
1 · What the graph read from it

What it found

Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.

The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.

2 · The registry

The trial behind it

Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.

Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.

3 · Its place in the literature

Who cites it

0 citing papers in PubMed.

No citing paper in PubMed yet.

4 · The record

Corrections and comments

PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.

5 · Who and what money

Authors and funding

8 authors.

Bao Lam *Department of Materials Science and Engineering, University of Illinois Urbana-Champaign, Urbana, IL, USA.ORCID http://orcid.org/0009-0000-4491-4638
Yung Man Yu *Department of Materials Science and Engineering, University of Illinois Urbana-Champaign, Urbana, IL, USA.ORCID http://orcid.org/0009-0006-4441-9323
Hyunjun Nam *Department of Materials Science and Engineering, University of Illinois Urbana-Champaign, Urbana, IL, USA.ORCID http://orcid.org/0000-0002-3816-2174
Hsu-Chih NiDepartment of Materials Science and Engineering, University of Illinois Urbana-Champaign, Urbana, IL, USA.ORCID http://orcid.org/0000-0002-8243-9783
Shomik ChatterjeeDepartment of Electrical and Computer Engineering, University of Illinois Urbana-Champaign, Urbana, IL, USA.
Shaloo RakhejaDepartment of Electrical and Computer Engineering, University of Illinois Urbana-Champaign, Urbana, IL, USA.
Jian-Min ZuoDepartment of Materials Science and Engineering, University of Illinois Urbana-Champaign, Urbana, IL, USA.ORCID http://orcid.org/0000-0002-5151-3370
Qing CaoDepartment of Materials Science and Engineering, University of Illinois Urbana-Champaign, Urbana, IL, USA. qingcao2@illinois.edu.ORCID http://orcid.org/0000-0002-5844-2376

Funding

No grant is acknowledged in the PubMed record.

6 · The paper itself

Abstract

Monolithic, three-dimensional (3D) integrated circuits promise advantages in packing density, energy consumption and interconnectivity bandwidth but require forming high-performance semiconductors and transistors on top tiers under the constraint of a limited thermal budget compatible with back-end-of-line integration

Identifiers

PMID42203869

What OpenQuestion holds

Textmetadata
Read underepoch 390

Registered trials

None linked

Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.