ArticleMicromachines2026
A Double-Layer Parallel MEMS Inductor with Enhanced Current-Carrying Capacity and Thermal Stability.
Article in Micromachines, 2026. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Not yet cited in PubMed.
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The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.
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8 authors.
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Abstract
As a core component in electronic circuits, the size of inductors is crucial for the thin-film integration and miniaturization of circuits. Although various miniaturized inductors have been fabricated by using integrated circuit technology, their low current-carrying capacity and small inductance values cannot meet current application requirements. Therefore, this paper designs an inductor chip based on a double-layer parallel (DLP) array microcoil structure. Experimental verification demonstrates that the developed DLP inductor exhibits a far superior rated energy storage capability per unit area compared to other single-layer inductors, along with excellent thermal performance. Meanwhile, the 4 × 3 DLP array can withstand a maximum DC current of 4.25 A. This structural innovation provides a meaningful thermal-electromagnetic co-design reference solution for highly reliable integrated power modules.
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