Evidence map›Paper›PMID 42185269›Full record

ArticleNature communications2026

Monolithic integration of p- and n-type doped 2D WSe

Yan Hu, Shicheng Zeng, Yi Wang, Jinshu Zhang, Yuxuan Zhu, Zhejia Zhang, Xiangqi Dong, Qicheng Sun, Mingrui Ao, Xinlong Guo and 23 more

Abstract read
PubMed Full text at PMC Publisher
In one paragraph

Article in Nature communications, 2026. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 1 paper.

0numbers the graph read from it
0cells of the map it votes in
1citing papers in PubMed
–field-weighted citation impact
1 · What the graph read from it

What it found

Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.

The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.

2 · The registry

The trial behind it

Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.

Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.

3 · Its place in the literature

Who cites it

1 citing paper in PubMed.

  1. Review
4 · The record

Corrections and comments

PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.

5 · Who and what money

Authors and funding

33 authors.

Yan Hu *State Key Laboratory of Integrated Chips and Systems, College of Integrated Circuits and Micro-Nano Electronics, Fudan University, Shanghai, China.
Shicheng Zeng *State Key Laboratory of Integrated Chips and Systems, College of Integrated Circuits and Micro-Nano Electronics, Fudan University, Shanghai, China.
Yi Wang *College of Big Data and Information Engineering, Guizhou University, Guiyang, China.
Jinshu ZhangState Key Laboratory of Integrated Chips and Systems, College of Integrated Circuits and Micro-Nano Electronics, Fudan University, Shanghai, China.
Yuxuan ZhuState Key Laboratory of Integrated Chips and Systems, College of Integrated Circuits and Micro-Nano Electronics, Fudan University, Shanghai, China.
Zhejia ZhangState Key Laboratory of Integrated Chips and Systems, College of Integrated Circuits and Micro-Nano Electronics, Fudan University, Shanghai, China.
Xiangqi DongState Key Laboratory of Integrated Chips and Systems, College of Integrated Circuits and Micro-Nano Electronics, Fudan University, Shanghai, China.
Qicheng SunState Key Laboratory of Integrated Chips and Systems, College of Integrated Circuits and Micro-Nano Electronics, Fudan University, Shanghai, China.
Mingrui AoState Key Laboratory of Integrated Chips and Systems, College of Integrated Circuits and Micro-Nano Electronics, Fudan University, Shanghai, China.
Xinlong GuoState Key Laboratory of Integrated Chips and Systems, College of Integrated Circuits and Micro-Nano Electronics, Fudan University, Shanghai, China.ORCID http://orcid.org/0009-0004-5909-6411
Jieya ShangState Key Laboratory of Integrated Chips and Systems, College of Integrated Circuits and Micro-Nano Electronics, Fudan University, Shanghai, China.
Yuexi WangState Key Laboratory of Integrated Chips and Systems, College of Integrated Circuits and Micro-Nano Electronics, Fudan University, Shanghai, China.
Chao LiuThe National Demonstrative School of Microelectronics, SEU-FEI Nano-Pico Center, Key Lab of MEMS of Ministry of Education, School of Integrated Circuits, Southeast University, Nanjing, China.
Yuchen TianState Key Laboratory of Integrated Chips and Systems, College of Integrated Circuits and Micro-Nano Electronics, Fudan University, Shanghai, China.
Haojie ChenState Key Laboratory of Integrated Chips and Systems, College of Integrated Circuits and Micro-Nano Electronics, Fudan University, Shanghai, China.
Xinliu HeState Key Laboratory of Integrated Chips and Systems, College of Integrated Circuits and Micro-Nano Electronics, Fudan University, Shanghai, China.
Yufei SongState Key Laboratory of Integrated Chips and Systems, College of Integrated Circuits and Micro-Nano Electronics, Fudan University, Shanghai, China.
Yue ZhangState Key Laboratory of Integrated Chips and Systems, College of Integrated Circuits and Micro-Nano Electronics, Fudan University, Shanghai, China.
Sen WangState Key Laboratory of Integrated Chips and Systems, College of Integrated Circuits and Micro-Nano Electronics, Fudan University, Shanghai, China.
Junlong ShiState Key Laboratory of Integrated Chips and Systems, College of Integrated Circuits and Micro-Nano Electronics, Fudan University, Shanghai, China.
Zhengjie SunState Key Laboratory of Integrated Chips and Systems, College of Integrated Circuits and Micro-Nano Electronics, Fudan University, Shanghai, China.
Jiahao WangState Key Laboratory of Integrated Chips and Systems, College of Integrated Circuits and Micro-Nano Electronics, Fudan University, Shanghai, China.
Jichao LiState Key Laboratory of Integrated Chips and Systems, College of Integrated Circuits and Micro-Nano Electronics, Fudan University, Shanghai, China.
Liping JiangState key Laboratory of Molecular Engineering of Polymers, Department of Macromolecular Science, Fudan University, Shanghai, China.
Lin WangState Key Laboratory of Flexible Electronics (LoFE), School of Flexible Electronics (Future Technologies) & Institute of Advanced Materials (IAM), Nanjing Tech University (NanjingTech), Nanjing, China.ORCID http://orcid.org/0000-0003-3033-4792
Chao ZhuThe National Demonstrative School of Microelectronics, SEU-FEI Nano-Pico Center, Key Lab of MEMS of Ministry of Education, School of Integrated Circuits, Southeast University, Nanjing, China.ORCID http://orcid.org/0000-0001-6383-3665
Zihan XuShenzhen SixCarbon Technology, Shenzhen, China.ORCID http://orcid.org/0000-0002-5632-0439
Saifei GouState Key Laboratory of Integrated Chips and Systems, College of Integrated Circuits and Micro-Nano Electronics, Fudan University, Shanghai, China.
Yin WangShaoxin Laboratory, Shaoxing, China.
Yin XiaShaoxin Laboratory, Shaoxing, China.
Xu WangCollege of Big Data and Information Engineering, Guizhou University, Guiyang, China. xuwang@gzu.edu.cn.ORCID http://orcid.org/0000-0001-6324-7359
Zhengzong SunState Key Laboratory of Integrated Chips and Systems, College of Integrated Circuits and Micro-Nano Electronics, Fudan University, Shanghai, China. zhengzong_sun@fudan.edu.cn.ORCID http://orcid.org/0000-0002-3710-4001
Wenzhong BaoShaoxin Laboratory, Shaoxing, China. baowz@fudan.edu.cn.ORCID http://orcid.org/0000-0002-3871-467X

Funding

National Natural Science Foundation of China (National Science Foundation of China) 62074043National Natural Science Foundation of China (National Science Foundation of China) 62334011, 52572158Science and Technology Commission of Shanghai Municipality (Shanghai Municipal Science and Technology Commission) 23JC1401100
6 · The paper itself

Abstract

Atomically thin two-dimensional (2D) semiconductors are promising candidates for next-generation electronics, which could effectively suppress short-channel effects and consequently reduce static power consumption. However, the lack of effective doping methods for 2D semiconductors remains a significant challenge, impeding the realization of homogeneous complementary metal-oxide-semiconductor (CMOS) integrated circuits (ICs). Here, we report the monolithic integration of wafer-scale homogeneous top-gated WSe

Identifiers

PMID42185269
PMCPMC13385718

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Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.