Evidence map›Paper›PMID 42180410›Full record

ArticleECS journal of solid state science and technology : JSS2025

Copper-Epoxy Interface Engineering for High-Frequency Chip-to-Chip Interconnects.

Junghyun Park, Ignace Agbadan, Monsuru Dauda, Mustapha Bello, John Hendershot, Soundarzo Tasnim, Omotolani Oduyebo, Sunggook Park, Anthony Engler, Jaimal Williamson and 3 more

Abstract read
PubMed Full text at PMC Publisher
In one paragraph

Article in ECS journal of solid state science and technology : JSS, 2025. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 1 paper.

0numbers the graph read from it
0cells of the map it votes in
1citing papers in PubMed
–field-weighted citation impact
1 · What the graph read from it

What it found

Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.

The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.

2 · The registry

The trial behind it

Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.

Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.

3 · Its place in the literature

Who cites it

1 citing paper in PubMed.

  1. Review
4 · The record

Corrections and comments

PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.

5 · Who and what money

Authors and funding

13 authors.

Junghyun ParkGordon A. and Mary Cain Department of Chemical Engineering, Louisiana State University, Baton Rouge, Louisiana 70803, United States of America.ORCID https://orcid.org/0009-0006-4507-8014
Ignace AgbadanGordon A. and Mary Cain Department of Chemical Engineering, Louisiana State University, Baton Rouge, Louisiana 70803, United States of America.ORCID https://orcid.org/0000-0002-7169-2564
Monsuru DaudaGordon A. and Mary Cain Department of Chemical Engineering, Louisiana State University, Baton Rouge, Louisiana 70803, United States of America.ORCID https://orcid.org/0000-0001-7607-2156
Mustapha BelloGordon A. and Mary Cain Department of Chemical Engineering, Louisiana State University, Baton Rouge, Louisiana 70803, United States of America.ORCID https://orcid.org/0000-0001-8903-2225
John HendershotGordon A. and Mary Cain Department of Chemical Engineering, Louisiana State University, Baton Rouge, Louisiana 70803, United States of America.ORCID https://orcid.org/0000-0002-3735-3163
Soundarzo TasnimGordon A. and Mary Cain Department of Chemical Engineering, Louisiana State University, Baton Rouge, Louisiana 70803, United States of America.ORCID https://orcid.org/0009-0009-5664-9777
Omotolani OduyeboGordon A. and Mary Cain Department of Chemical Engineering, Louisiana State University, Baton Rouge, Louisiana 70803, United States of America.ORCID https://orcid.org/0009-0007-8933-6262
Sunggook ParkDepartment of Mechanical & Industrial Engineering and Center for Bio-Modular Multiscale Systems, Louisiana State University, Baton Rouge, Louisiana 70803, United States of America.ORCID https://orcid.org/0000-0003-0424-6318
Anthony EnglerGordon A. and Mary Cain Department of Chemical Engineering, Louisiana State University, Baton Rouge, Louisiana 70803, United States of America.ORCID https://orcid.org/0000-0003-3923-2303
Jaimal WilliamsonTexas Instruments Incorporated, Dallas, Texas 75243, United States of America.ORCID https://orcid.org/0000-0001-7702-3292
Varughese MathewNXP Semiconductors, Austin, Texas 78735, United States of America.
Cigdem Atalay-OralGordon A. and Mary Cain Department of Chemical Engineering, Louisiana State University, Baton Rouge, Louisiana 70803, United States of America.ORCID https://orcid.org/0000-0002-8773-2348
John FlakeGordon A. and Mary Cain Department of Chemical Engineering, Louisiana State University, Baton Rouge, Louisiana 70803, United States of America.ORCID https://orcid.org/0000-0002-9187-3143

Funding

No grant is acknowledged in the PubMed record.

6 · The paper itself

Abstract

The reliability of high-frequency chip-to-chip (C2C) interconnects requires the durability of Cu interconnects and polymer dielectric interfaces. In this study, we examine the temperature cycling performance of Cu-epoxy interfaces, including methylimidazole and amine functional silane adhesion promoters along with electroplated or electroless metal interlayers such as Ni, NiCo

Indexed as

Chip-to-chip (C2C) interconnectcladdingcoupling agentmetal interlayermultichip packageoxidationpolymer-metal adhesion

Identifiers

PMID42180410
PMCPMC13193054

What OpenQuestion holds

Textmetadata
LicenceCC BY
Read underepoch 390

Registered trials

None linked

Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.