ReviewMicrosystems & nanoengineering2026
A review of glass thermal reflow: method, device, and applications.
Review in Microsystems & nanoengineering, 2026. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Not yet cited in PubMed.
What it found
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The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.
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Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.
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0 citing papers in PubMed.
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Authors and funding
14 authors.
Funding
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Abstract
Glass thermal reflow has emerged as a versatile technique for fabricating high-aspect-ratio and defect-controlled glass microstructures, offering a compelling alternative to conventional etching or laser-based approaches in MEMS and microsystem technologies. This review systematically summarizes the development of glass thermal reflow, including theoretical formula, simulation model, and key processing parameters that govern flow depth, morphology, and defect evolution. Recent advances in extended methods like double-sided reflow and glass-powder sintering are discussed, along with applications in unconventional microstructures, thermal and electrical insulation, and optical modulation devices. Future research is expected to couple advanced modeling and in situ characterization with material innovations to expand the scope of glass thermal reflow in next-generation MEMS, optical, and bioelectronic devices.
Identifiers
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Registered trials
Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.