Evidence map›Paper›PMID 42129150›Full record

ReviewMicrosystems & nanoengineering2026

A review of glass thermal reflow: method, device, and applications.

Minjie Zhu, Penghong Shi, Guoqin Zhang, Changzhao Yan, Fanhong Chen, Shuai Liu, Ruichao Lian, Kehan Zhu, Huanyu Dai, Hao Wu and 4 more

Abstract readReview
In one paragraph

Review in Microsystems & nanoengineering, 2026. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Not yet cited in PubMed.

0numbers the graph read from it
0cells of the map it votes in
0citing papers in PubMed
–field-weighted citation impact
1 · What the graph read from it

What it found

Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.

The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.

2 · The registry

The trial behind it

Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.

Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.

3 · Its place in the literature

Who cites it

0 citing papers in PubMed.

No citing paper in PubMed yet.

4 · The record

Corrections and comments

PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.

5 · Who and what money

Authors and funding

14 authors.

Minjie Zhu *Instrumentation Technology and Economy Institute, Beijing, 100055, China. zmj@tc124.com.
Penghong Shi *Guangdong Provincial Key Laboratory of Intelligent Morphing Mechanisms and Adaptive Robotics and School of Robotics and Advanced Manufacture, Harbin Institute of Technology, Shenzhen, 518052, China.
Guoqin ZhangInstrumentation Technology and Economy Institute, Beijing, 100055, China.
Changzhao YanGuangdong Provincial Key Laboratory of Intelligent Morphing Mechanisms and Adaptive Robotics and School of Robotics and Advanced Manufacture, Harbin Institute of Technology, Shenzhen, 518052, China.
Fanhong ChenInstrumentation Technology and Economy Institute, Beijing, 100055, China.
Shuai LiuInstrumentation Technology and Economy Institute, Beijing, 100055, China.
Ruichao LianInstrumentation Technology and Economy Institute, Beijing, 100055, China.
Kehan ZhuInstrumentation Technology and Economy Institute, Beijing, 100055, China.
Huanyu DaiGuangdong Provincial Key Laboratory of Intelligent Morphing Mechanisms and Adaptive Robotics and School of Robotics and Advanced Manufacture, Harbin Institute of Technology, Shenzhen, 518052, China.
Hao WuGuangdong Provincial Key Laboratory of Intelligent Morphing Mechanisms and Adaptive Robotics and School of Robotics and Advanced Manufacture, Harbin Institute of Technology, Shenzhen, 518052, China.
Yun LiuGuangdong Provincial Key Laboratory of Intelligent Morphing Mechanisms and Adaptive Robotics and School of Robotics and Advanced Manufacture, Harbin Institute of Technology, Shenzhen, 518052, China.
Bing LiGuangdong Provincial Key Laboratory of Intelligent Morphing Mechanisms and Adaptive Robotics and School of Robotics and Advanced Manufacture, Harbin Institute of Technology, Shenzhen, 518052, China.
Xiaohui DuInstrumentation Technology and Economy Institute, Beijing, 100055, China.
Gaopeng XueGuangdong Provincial Key Laboratory of Intelligent Morphing Mechanisms and Adaptive Robotics and School of Robotics and Advanced Manufacture, Harbin Institute of Technology, Shenzhen, 518052, China. xuegaopeng@hit.edu.cn.

Funding

No grant is acknowledged in the PubMed record.

6 · The paper itself

Abstract

Glass thermal reflow has emerged as a versatile technique for fabricating high-aspect-ratio and defect-controlled glass microstructures, offering a compelling alternative to conventional etching or laser-based approaches in MEMS and microsystem technologies. This review systematically summarizes the development of glass thermal reflow, including theoretical formula, simulation model, and key processing parameters that govern flow depth, morphology, and defect evolution. Recent advances in extended methods like double-sided reflow and glass-powder sintering are discussed, along with applications in unconventional microstructures, thermal and electrical insulation, and optical modulation devices. Future research is expected to couple advanced modeling and in situ characterization with material innovations to expand the scope of glass thermal reflow in next-generation MEMS, optical, and bioelectronic devices.

Identifiers

PMID42129150
PMCPMC13172517

What OpenQuestion holds

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Registered trials

None linked

Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.