ArticleMaterials (Basel, Switzerland)2026
Thin Copper Foils: From Electrodeposition Conditions to Adhesion Performances.
Article in Materials (Basel, Switzerland), 2026. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Not yet cited in PubMed.
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Abstract
Cathodic electrodeposition of copper on molybdenum and stainless-steel substrates has been investigated with the aim of examining their potential to produce thin copper foils (TCFs). Copper in the form of a thin film was electrodeposited galvanostatically from the acidic sulfate electrolyte without and with an addition of suppressor/activator additives, such as chloride ions, polyethylene glycol 6000 and 3-mercapto-1-propanesulfonic acid. The cathodes and electrodeposited Cu films were characterized by SEM, AFM, and XRD techniques, while the adhesion of Cu films, as a crucial parameter in the production of Cu foils, was estimated by a lab-made prototype of a bending test machine made by applying additive technology. The adhesion parameter named "critical cycle number" (
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