ArticleMicrosystems & nanoengineering2026
Heterogeneous integration of micro-LEDs via multiple simultaneous transfer and bonding.
Article in Microsystems & nanoengineering, 2026. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Not yet cited in PubMed.
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The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.
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Authors and funding
10 authors.
Funding
Abstract
Micro light-emitting diodes (Micro-LEDs) have emerged as next-generation display technologies because of their outstanding performance and stability. However, the assembly of Micro-LEDs with various colors, functions, and dimensions for full-color displays has been limited by the irreversible bonding between the Micro-LEDs and the backplanes. Here, we report a multiple simultaneous transfer and bonding (SITRAB) technology for the heterogeneous integration of Micro-LEDs. During the SITRAB process, Micro-LEDs were transferred and bonded onto display substrates within a few seconds through laser-induced soldering. Despite repeated infrared laser exposures, SITRAB adhesive, our bonding material, maintained its soldering capability. Therefore, Micro-LEDs from different interposers were sequentially integrated with the same backplane by repeating SITRAB. For instance, AlGaInP and InGaN LEDs were integrated onto a passive-matrix backplane, displaying a 165 pixels-per-inch image. 15 × 15 Micro-LED arrays were stitched to scale a display size by four times. Redundant LEDs were instantly transferred onto a defective display to achieve a 99.80% pixel yield. RGB Micro-LEDs with different chip thicknesses were assembled on a glass backplane to demonstrate a 32 × 32 resolution full-color display.
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Registered trials
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