ArticlePolymers2026
Modeling of Polyolefin-Aluminum Bonding Technology Under Electromagnetic Energy: Using Hot-Melt Adhesives with Metallic Micro-Additives.
Article in Polymers, 2026. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Not yet cited in PubMed.
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6 authors.
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Abstract
Polyolefin bonding technologies with metal foils are extensively employed in various sectors, particularly in automotive, electronics, and aerospace industries. This research examined the innovative electromagnetic joining of polyolefins to aluminum by evaluating the behavior of hot-melt adhesives derived from polyolefins containing metallic particles. The study aimed at establishing the specific absorption rate (SAR, expressed in W/kg) via electromagnetic simulation using CST Studio Suite software. It was observed that, regardless of particle size, Al was the most efficient particle, while the distribution of particles has a negligible impact on Total SAR values. The most significant beneficial effect of the inserts on the absorption capacity of the hot-melt material is primarily observed with a particle size of 1 μm. When connecting polyolefins to aluminum, the power loss density and SAR values exceed those for bonding polyolefins to polyolefins by at least 10 times, owing to aluminum's conductive properties, which influence the absorption of additional energy in the hot melt mass, likely due to the Salisbury screen effect generated by the bonding arrangement. For hot melts made from polyethylene, a higher frequency of 5.8 GHz is suggested, which is a newly approved frequency used in advanced industrial applications. This positively impacts the effectiveness and viability of the bonding process of polyolefins to aluminum, resulting in reduced exposure times and/or decreased microwave exposure power. It was observed that the hot melts derived from HDPE and PP yielded greater SAR values. Conversely, the SAR values increase when aluminum is attached to HDPE. As a result, the strongest bond of polyolefins to Al occurs when connecting HDPE to Al using HDPE-based hot melts. The proposed simulation methodology may offer considerable improvement in evaluating the efficacy of bonding technology for dissimilar materials subjected to electromagnetic energy.
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