Universal High-Resolution Copper Patterning on Diverse Substrates via Sequential Laser-Induced Transfer and Electroless Plating.

The fabrication of high-resolution and mechanically robust copper patterns remain a critical challenge in flexible electronics. Here, we present a universal metallization strategy that combines sequential two-step laser transfer, including laser-induced backward transfer and laser-induced forward transfer, with subsequent electroless copper plating. In this approach, laser-induced backward transfer first generates a transferable copper particle donor layer; subsequently, laser-induced forward transfer selectively embeds these catalytic copper particles into the surface of target substrates, constructing spatially confined activation networks while minimizing direct thermal exposure. These embedded seeds are then amplified into continuous copper conductors via electroless copper plating, achieving a high-resolution pattern (average minimum linewidth of approximately 20 μm) with robust interfacial integrity. Benefiting from laser-induced mechanical interlocking, the resulting copper patterns exhibit a low electrical resistivity of ~2.0 × 10