ArticleMaterials (Basel, Switzerland)2026
Phase-Field Damage Modeling of Electromechanical Fracture in MEMS Piezoelectric Films.
Article in Materials (Basel, Switzerland), 2026. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Not yet cited in PubMed.
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Abstract
Piezoelectric thin films have been widely used in micro-electromechanical systems (MEMSs), such as sensors, actuators, and resonant devices. Electromechanically driven fractures can severely degrade device performance and reliability. In this work, a phase-field damage model is developed for MEMS piezoelectric thin films under coupled electromechanical loading, incorporating pre-existing defects via an equivalent local fracture toughness. Microcracks and micro-voids arising from manufacturing defects are integrated into the model through an effective local fracture toughness, enabling a unified description of their roles in crack initiation and propagation. The proposed model is implemented in ABAQUS by means of a user-defined element (UEL) subroutine and solved using a staggered scheme. Numerical results show that the level of pre-existing defects, the applied electric potential, and the polarization direction all exert significant effects on fracture behavior. As the defect parameter
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