Effects of Annealing Temperature on Interfacial Structure and Thermal Conductivity of Hot-Pressed Copper/Cr-Coated Diamond Composites.

Yajing Liu, Xiaohong Chen, Yong Liu, Wei Tian, Fanfan Zhou, Honglei Zhou, Yicheng Wang

Abstract read

In one paragraph

Article in Materials (Basel, Switzerland), 2026. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Not yet cited in PubMed.

0numbers the graph read from it

0cells of the map it votes in

0citing papers in PubMed

–field-weighted citation impact

1 · What the graph read from it

What it found

Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.

The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.

2 · The registry

The trial behind it

Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.

Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.

3 · Its place in the literature

Who cites it

0 citing papers in PubMed.

No citing paper in PubMed yet.

4 · The record

Corrections and comments

PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.

5 · Who and what money

Authors and funding

7 authors.

Yajing LiuCollege of Science, University of Shanghai for Science and Technology, Shanghai 200093, China.

Xiaohong ChenSchool of Materials Science and Engineering, University of Shanghai for Science and Technology, Shanghai 200093, China.

Yong LiuSchool of Materials Science and Engineering, University of Shanghai for Science and Technology, Shanghai 200093, China.

Wei TianCollege of Science, University of Shanghai for Science and Technology, Shanghai 200093, China.ORCID 0000-0002-1560-0223

Fanfan ZhouSchool of Materials Science and Engineering, University of Shanghai for Science and Technology, Shanghai 200093, China.

Honglei ZhouSchool of Materials Science and Engineering, University of Shanghai for Science and Technology, Shanghai 200093, China.

Yicheng WangSchool of Materials Science and Engineering, University of Shanghai for Science and Technology, Shanghai 200093, China.

Funding

the National Natural Science Foundation of China No. 51201107the State Key Laboratory of Advanced Optical Communication Systems and Networks No. 2018GZKF03007

6 · The paper itself

Abstract

Efficient heat dissipation is crucial for semiconductor devices; however, conventional thermal management materials often cannot meet practical demands because of inadequate thermal conductivity and mismatched coefficients of thermal expansion with semiconductor materials. In this study, we develop a synergistic process integrating magnetron sputtering and annealing to fabricate a composition-controllable Cr/Cr

Indexed as

carbidesdiamond/copper compositesinterface designinterfacial thermal conductivitymagnetron sputteringthermal conductivity

Identifiers

PMID42073701

DOI10.3390/ma19081534

PMCPMC13117537

What OpenQuestion holds

Textmetadata

LicenceCC BY

Read underepoch 390

Registered trials

None linked

Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.