Optimization of Processing Parameters and Application Performance Evaluation of a High Thermal Conductivity, Low Thermal Resistance Gel.

Thermal interface materials (TIMs) are essential for addressing heat dissipation challenges in high-performance electronic devices. Among various TIMs, thermal conductive gels exhibit significant potential in high heat flux applications due to their excellent flexibility and superior gap-filling capability. Current research primarily concentrates on the fabrication and performance characterization of novel thermal conductive gels, while comparatively little attention has been devoted to the optimization of processing parameters. Furthermore, existing characterization methods often fail to accurately replicate real-world operating conditions, resulting in discrepancies between laboratory measurements and actual performance. An orthogonal experimental design was adopted to systematically elucidate the influence of filler ratio, wetting time, and silicone oil viscosity on the bonding strength of thermal conductive gels. The filler ratio exerts the most significant influence, followed by silicone oil viscosity and wetting time. Subsequently, the thermal conductivity and thermal resistance of both commercial thermal conductive gels and the as-prepared gels were characterized using the steady-state heat flow method and the double-interface method, respectively. Under the optimized preparation conditions (filler ratio of 88%, silicone oil viscosity of 600 cP, and wetting time of 14 h), the self-developed thermal conductive gel exhibits a thermal conductivity of 3.75 W·m