Evidence map›Paper›PMID 42011902›Full record

ArticleAdvanced science (Weinheim, Baden-Wurttemberg, Germany)2026

CMOS-Integrated Synaptic Photoreceptor Chip Inspired by Insect Visual Processing.

Jian Chai, Xinyi Xu, Yue Wang, Xiaochen Wang, Hailiang Wang, Yunfei Xie, Xinwei Zhang, Haoyu Wang, Hao Ning, Jiangming Lin and 16 more

Abstract read
PubMed Full text at PMC Publisher
In one paragraph

Article in Advanced science (Weinheim, Baden-Wurttemberg, Germany), 2026. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Not yet cited in PubMed.

0numbers the graph read from it
0cells of the map it votes in
0citing papers in PubMed
–field-weighted citation impact
1 · What the graph read from it

What it found

Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.

The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.

2 · The registry

The trial behind it

Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.

Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.

3 · Its place in the literature

Who cites it

0 citing papers in PubMed.

No citing paper in PubMed yet.

4 · The record

Corrections and comments

PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.

5 · Who and what money

Authors and funding

26 authors.

Jian ChaiCollege of Integrated Circuits, State Key Laboratory of Silicon and Advanced Semiconductor Materials, ZJU-HIC, Center of CMOS IC Manufacturing Process and Design, Zhejiang University, Hangzhou, China.
Xinyi XuCollege of Integrated Circuits, State Key Laboratory of Silicon and Advanced Semiconductor Materials, ZJU-HIC, Center of CMOS IC Manufacturing Process and Design, Zhejiang University, Hangzhou, China.
Yue WangState Key Laboratory of Silicon and Advanced Semiconductor Materials & School of Materials Science and Engineering, Zhejiang University, Hangzhou, Zhejiang, China.ORCID https://orcid.org/0000-0002-3766-3698
Xiaochen WangCollege of Integrated Circuits, State Key Laboratory of Silicon and Advanced Semiconductor Materials, ZJU-HIC, Center of CMOS IC Manufacturing Process and Design, Zhejiang University, Hangzhou, China.
Hailiang WangCollege of Integrated Circuits, State Key Laboratory of Silicon and Advanced Semiconductor Materials, ZJU-HIC, Center of CMOS IC Manufacturing Process and Design, Zhejiang University, Hangzhou, China.
Yunfei XieCollege of Integrated Circuits, State Key Laboratory of Silicon and Advanced Semiconductor Materials, ZJU-HIC, Center of CMOS IC Manufacturing Process and Design, Zhejiang University, Hangzhou, China.
Xinwei ZhangCollege of Integrated Circuits, State Key Laboratory of Silicon and Advanced Semiconductor Materials, ZJU-HIC, Center of CMOS IC Manufacturing Process and Design, Zhejiang University, Hangzhou, China.
Haoyu WangCollege of Integrated Circuits, State Key Laboratory of Silicon and Advanced Semiconductor Materials, ZJU-HIC, Center of CMOS IC Manufacturing Process and Design, Zhejiang University, Hangzhou, China.
Hao NingCollege of Integrated Circuits, State Key Laboratory of Silicon and Advanced Semiconductor Materials, ZJU-HIC, Center of CMOS IC Manufacturing Process and Design, Zhejiang University, Hangzhou, China.
Jiangming LinCollege of Integrated Circuits, State Key Laboratory of Silicon and Advanced Semiconductor Materials, ZJU-HIC, Center of CMOS IC Manufacturing Process and Design, Zhejiang University, Hangzhou, China.
Yongliang XieCollege of Integrated Circuits, State Key Laboratory of Silicon and Advanced Semiconductor Materials, ZJU-HIC, Center of CMOS IC Manufacturing Process and Design, Zhejiang University, Hangzhou, China.
Qihai JiangZJU-UIUC Institute, International Campus, Zhejiang University, Haining, China.
Baoshi QiaoZJU-UIUC Institute, International Campus, Zhejiang University, Haining, China.
Xiaolei DingZJU-UIUC Institute, International Campus, Zhejiang University, Haining, China.
Luyao MaCollege of Artificial Intelligence, Southwest University, Chongqing, China.
Shukai DuanCollege of Artificial Intelligence, Southwest University, Chongqing, China.
Zhenyi NiState Key Laboratory of Silicon and Advanced Semiconductor Materials & School of Materials Science and Engineering, Zhejiang University, Hangzhou, Zhejiang, China.ORCID https://orcid.org/0000-0002-8379-9182
Huan HuZJU-UIUC Institute, International Campus, Zhejiang University, Haining, China.
Xin HeZJU-Hangzhou Global Scientific and Technological Innovation Center, Zhejiang University, Hangzhou, China.
Fei XueZJU-Hangzhou Global Scientific and Technological Innovation Center, Zhejiang University, Hangzhou, China.ORCID https://orcid.org/0000-0001-9039-7088
Feichi ZhouSchool of Microelectronics, Southern University of Science and Technology, Shenzhen, China.ORCID https://orcid.org/0000-0001-7756-1082
Lingfei LiCollege of Integrated Circuits, State Key Laboratory of Silicon and Advanced Semiconductor Materials, ZJU-HIC, Center of CMOS IC Manufacturing Process and Design, Zhejiang University, Hangzhou, China.
Srikrishna Chanakya BodepudiCollege of Integrated Circuits, State Key Laboratory of Silicon and Advanced Semiconductor Materials, ZJU-HIC, Center of CMOS IC Manufacturing Process and Design, Zhejiang University, Hangzhou, China.
Rui YuanZJU-UIUC Institute, International Campus, Zhejiang University, Haining, China.
Bin YuCollege of Integrated Circuits, State Key Laboratory of Silicon and Advanced Semiconductor Materials, ZJU-HIC, Center of CMOS IC Manufacturing Process and Design, Zhejiang University, Hangzhou, China.
Yang XuCollege of Integrated Circuits, State Key Laboratory of Silicon and Advanced Semiconductor Materials, ZJU-HIC, Center of CMOS IC Manufacturing Process and Design, Zhejiang University, Hangzhou, China.ORCID https://orcid.org/0000-0003-3148-7678

Funding

National Key Research and Development Program of China 2022YFA1204304National Natural Science Foundation of China 62406260NSFC of Zhejiang Province LDT23F0401NSFC of Zhejiang Province LDT23F04013F04Zhejiang Provincial Natural Science Foundation of China ZCLQN25F0401
6 · The paper itself

Abstract

Bionic visual processing hardware serves as the core technology for mimicking the efficient information processing of biological vision systems and forms the foundation for perceiving and recognizing both static and dynamic scenes. However, most current bionic visual hardware remains at the level of individual devices and simple arrays. Full hardware implementation of bionic vision chips, as well as comprehensive demonstrations in practical application scenarios, is still scarce. This work proposes a complete optoelectronic insect-inspired visual sensor. We realize a Si QDs/ReS

Indexed as

BiomimeticsBionicsInsectaVisual PerceptionAnimalsEquipment DesignPhotoreceptor Cells, InvertebrateDepth perceptiondynamic trajectory trackingSiQDs/ReS2 neuromorphic image sensor chipstatic feature recognition

Identifiers

PMID42011902
PMCPMC13335448

What OpenQuestion holds

Textmetadata
LicenceCC BY
Read underepoch 390

Registered trials

None linked

Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.