ArticleScientific reports2026
Functionalized recycled NMPCB with fatty acids for advanced epoxy composite development.
Article in Scientific reports, 2026. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Not yet cited in PubMed.
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Authors and funding
3 authors.
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Abstract
Non-metallic printed circuit boards (NMPCB), derived from discarded printed circuit boards (PCB), predominantly consist of cured resin and fibre. This study explores the potential of repurposing non-metallic components from waste printed circuit boards (PCB) as fillers in epoxy matrices rather than resorting to incineration for metal recovery. In this investigation, the NMPCB material from a PCB was crushed into powder and mixed with matrix epoxy to develop an epoxy/NMPCB composite. Fatty acids, such as palmitic acid (PA) and stearic acid (SA), were employed to enhance the mechanical and thermal characteristics of the composite. The study focusses on generating epoxy composites by combining an epoxy matrix with fatty acid-modified NMPCB at different concentrations (0.1, 0.5, and 1.0 M). The mechanical and thermal properties of these composites, particularly those treated with stearic acid (epoxy/NMPCB-SA) and palmitic acid (epoxy/NMPCB-PA), were thoroughly compared. The results show that epoxy/NMPCB-1.0 M SA demonstrated high thermal stability, with 51.24% in char yield. This improvement is also supported by a 68.4% reduction in tensile strength and significant gains in stiffness and toughness, shown by an 83.85% and 70% increase in modulus and impact strength respectively outperforming both epoxy with unmodified NMPCB and epoxy/NMPCB-PA composites.
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