Highly Vertically Oriented Graphene Microstrip Pads With Ultrahigh Through-Plane Thermal Conductivity and Ultralow Compressive Modulus for Efficient Heat Dissipation.

Xu Ran, Yaru Wang, Sijia Wu, Hejun Wang, Junhao Shen, Litao Sun, Xing Wu, Hengchang Bi

Abstract read

In one paragraph

Article in Advanced science (Weinheim, Baden-Wurttemberg, Germany), 2026. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Not yet cited in PubMed.

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0citing papers in PubMed

–field-weighted citation impact

1 · What the graph read from it

What it found

Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.

The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.

2 · The registry

The trial behind it

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Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.

3 · Its place in the literature

Who cites it

0 citing papers in PubMed.

No citing paper in PubMed yet.

4 · The record

Corrections and comments

PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.

5 · Who and what money

Authors and funding

8 authors.

Xu RanIn Situ Devices Center, School of Integrated Circuits, East China Normal University, Shanghai, P. R. China.

Yaru WangIn Situ Devices Center, School of Integrated Circuits, East China Normal University, Shanghai, P. R. China.

Sijia WuIn Situ Devices Center, School of Integrated Circuits, East China Normal University, Shanghai, P. R. China.

Hejun WangIn Situ Devices Center, School of Integrated Circuits, East China Normal University, Shanghai, P. R. China.

Junhao ShenIn Situ Devices Center, School of Integrated Circuits, East China Normal University, Shanghai, P. R. China.

Litao SunSEU-FEI Nano-Pico Center, Key Laboratory of MEMS of Ministry of Education, Collaborative Innovation Center for Micro/Nano Fabrication, Device and System, Southeast University, Nanjing, P. R. China.

Xing WuIn Situ Devices Center, School of Integrated Circuits, East China Normal University, Shanghai, P. R. China.

Hengchang BiIn Situ Devices Center, School of Integrated Circuits, East China Normal University, Shanghai, P. R. China.

Funding

Key Research and Development Program of Jiangsu province BE2023009National Natural Science Foundation of China 92580138Projects of Science and Technology Commission of Shanghai Municipality 25JD1404502Projects of Science and Technology Commission of Shanghai Municipality 25ZR1401093

6 · The paper itself

Abstract

The increasing heat generation in microelectronic devices demands efficient thermal interface materials (TIMs) to prevent overheating. However, the persistent trade-off between high through-plane thermal conductivity and excellent compliance remains a fundamental barrier for TIMs. Herein, we prepare a vertically oriented graphene microstrip pad (GMP) with both ultrahigh thermal conductivity and ultralow compressive modulus by aligning graphene microstrips vertically and encapsulating them in silicone rubber. The graphene microstrips align vertically with excellent orientation, forming continuous pathways for heat conduction. By optimizing the graphene content to 60 wt.% (GMP60), we achieve an ultrahigh through-plane thermal conductivity of 565.92 W m

Indexed as

compressive modulusgraphene microstripsthermal conductivitythermal interface materialsvertical orientation

Identifiers

PMID41995186

DOI10.1002/advs.75359

PMCPMC13335742

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LicenceCC BY

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Registered trials

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Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.