ArticleNanomaterials (Basel, Switzerland)2026
An Analytical Modeling Study on the Thermal Behavior of Copper-Carbon Nanotube Composite Through-Silicon Via (TSV).
Article in Nanomaterials (Basel, Switzerland), 2026. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Not yet cited in PubMed.
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Abstract
In this study, the Monte Carlo (MC) method is employed to generate the diameter and relative positional distributions of carbon nanotubes (CNTs). Based on this, we develop a three-layer thermal model for a copper-carbon nanotube (Cu-CNT) through-silicon via (TSV). By integrating Gauss-Hermite quadrature with the Law of Large Numbers (LLN), an analytical expression for thermal conductivity is derived, enabling efficient and accurate estimation of the thermal conductivity of Cu-CNT-filled TSV. Contrary to expectations, the thermal conductivity of TSV does not increase significantly with CNT volume fraction, primarily due to the interfacial thermal resistance at Cu-CNT and CNT-CNT junctions. Through calibration against previously reported experimental data, the effective Cu-CNT interfacial thermal resistance is estimated to be on the order of 10
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