ArticleCommunications engineering2026
Co-packaged electronics with microfluidics for direct-to-package cooling.
Article in Communications engineering, 2026. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Not yet cited in PubMed.
What it found
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The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.
The trial behind it
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Authors and funding
8 authors.
Funding
No grant is acknowledged in the PubMed record.
Abstract
Power semiconductors operating under high heat fluxes and elevated temperatures rely on liquid-cooled heat sinks with substantial coolant volumes. Recent advancements in direct-to-chip (D2C) cooling techniques have shown enhanced thermal performance, reduced energy consumption, compact form factor, and minimized coolant usage. However, integrating microchannels onto semiconductor substrates poses significant fabrication challenges. Hence, we propose a direct-to-package (D2P) cooling approach that embeds microchannels within the package substrate, thereby bypassing the need for Thermal Interface Materials and complex fabrication processes. This D2P approach achieves high heat flux dissipation (up to ~ 625 W cm
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Registered trials
Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.