Towards universal multi-dimensional parallelization communications by direct diverse fiber/3D/2D chip hybrid integration.

Kang Li, Chengkun Cai, Guofeng Yan, Bing Han, Hang Chen, Guangze Wu, Jian Wang

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Article in Nature communications, 2026. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Not yet cited in PubMed.

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7 authors.

Kang Li *Wuhan National Laboratory for Optoelectronics and School of Optical and Electronic Information, Huazhong University of Science and Technology, Wuhan, China.

Chengkun Cai *Wuhan National Laboratory for Optoelectronics and School of Optical and Electronic Information, Huazhong University of Science and Technology, Wuhan, China.

Guofeng Yan *Wuhan National Laboratory for Optoelectronics and School of Optical and Electronic Information, Huazhong University of Science and Technology, Wuhan, China.

Bing HanWuhan National Laboratory for Optoelectronics and School of Optical and Electronic Information, Huazhong University of Science and Technology, Wuhan, China.

Hang ChenWuhan National Laboratory for Optoelectronics and School of Optical and Electronic Information, Huazhong University of Science and Technology, Wuhan, China.

Guangze WuWuhan National Laboratory for Optoelectronics and School of Optical and Electronic Information, Huazhong University of Science and Technology, Wuhan, China.

Jian WangWuhan National Laboratory for Optoelectronics and School of Optical and Electronic Information, Huazhong University of Science and Technology, Wuhan, China. jwang@hust.edu.cn.ORCID http://orcid.org/0000-0002-0579-3041

Funding

No grant is acknowledged in the PubMed record.

6 · The paper itself

Abstract

Space-division multiplexing (SDM) is a promising technology for significantly increasing the capacity of a single fiber or waveguide. Various SDM fibers, including few-mode fibers (FMFs), multi-core fibers (MCFs), and orbital angular momentum fibers (OAMFs), demonstrate distinct advantages in fiber links, driving a prevailing trend toward their parallel utilization. Photonic integrated circuits extend SDM from long-distance fibers to chip-scale interconnects. However, mode-field mismatches between fibers and chips pose compatibility challenges. Here, we develop diverse fiber-chip couplers via fiber/3D/2D chip hybrid integration to achieve seamless "fiber-to-fiber" and "fiber-to-chip" mode-field conversions. Building on this, we integrate large-scale, multifunctional 2D silicon chips to construct a fiber-chip-fiber system compatible with FMF, MCF, OAMF, and single-mode fibers. This parallel communication successfully demonstrates 288 channels (8 spatial modes and 36 wavelengths) and 30-Tbit/s capacity. This work establishes a universal multi-dimensional parallelization communication architecture, paving the way for next-generation multi-dimensional data transmission and management.

Identifiers

PMID41807457

DOI10.1038/s41467-026-70455-7

PMCPMC13106703

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Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.