Evidence map›Paper›PMID 41746163›Full record

ArticleAdvanced science (Weinheim, Baden-Wurttemberg, Germany)2026

A Strain Decoupling Packaging Strategy for High-Fidelity Ultrathin Silicon Shape Sensors for Soft Medical Robotics.

Hao Liu, Masahito Takakuwa, Michitaka Yamamoto, Yiwen Wang, Tomoyuki Yokota, Takao Someya, Toshihiro Itoh, Seiichi Takamatsu

Abstract read
In one paragraph

Article in Advanced science (Weinheim, Baden-Wurttemberg, Germany), 2026. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 1 paper.

0numbers the graph read from it
0cells of the map it votes in
1citing papers in PubMed
–field-weighted citation impact
1 · What the graph read from it

What it found

Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.

The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.

2 · The registry

The trial behind it

Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.

Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.

3 · Its place in the literature

Who cites it

1 citing paper in PubMed.

  1. Progress in Strain Engineering of 2D-Integrated Heterostructures for Ultrasensitive Sensors.Advanced science (Weinheim, Baden-Wurttemberg, Germany) · 2026
    Review
4 · The record

Corrections and comments

PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.

5 · Who and what money

Authors and funding

8 authors.

Hao LiuDepartment of Precision Engineering, Graduate School of Engineering, The University of Tokyo, Tokyo, Japan.ORCID https://orcid.org/0009-0000-2100-210X
Masahito TakakuwaInstitute of Engineering Innovation, Graduate School of Engineering, The University of Tokyo, Tokyo, Japan.
Michitaka YamamotoDepartment of Precision Engineering, Graduate School of Engineering, The University of Tokyo, Tokyo, Japan.
Yiwen WangDepartment of Precision Engineering, Graduate School of Engineering, The University of Tokyo, Tokyo, Japan.
Tomoyuki YokotaInstitute of Engineering Innovation, Graduate School of Engineering, The University of Tokyo, Tokyo, Japan.
Takao SomeyaSchool of Systems Science and Industrial Engineering, Thomas J. Watson College of Engineering and Applied Science, State University of New York at Binghamton, Binghamton, New York, USA.
Toshihiro ItohDepartment of Precision Engineering, Graduate School of Engineering, The University of Tokyo, Tokyo, Japan.
Seiichi TakamatsuSchool of Systems Science and Industrial Engineering, Thomas J. Watson College of Engineering and Applied Science, State University of New York at Binghamton, Binghamton, New York, USA.ORCID https://orcid.org/0000-0001-6502-7819

Funding

Japan Science and Technology Agency JPMJSP2108JSPS KAKENHI JP24K17317Ministry of Education, Culture, Sports, Science and Technology JPMXP1224UT1114
6 · The paper itself

Abstract

Reliable soft sensors are essential for precise control, real-time feedback, and safe operation in soft medical robots. Ultrathin silicon piezoresistive sensors offer flexibility, durability, and high sensitivity, but protecting them from external stress while maintaining softness remains challenging. Existing packaging strategies often compromise flexibility and induce excessive strain, leading to device failure. Here, we introduce an oil-lubricated slidable packaging approach that enables high-fidelity shape sensing of ultrathin silicon gauges by mechanically isolating the sensing element within a dual-layer film. This design decouples the sensor from the packaging, minimizing bending strain on the sensing element. Experimental results show that the sensor maintains stable and reliable signals under large applied strains, with fast response (<0.40 s), low hysteresis (∼3 %), and durability over more than 10 000 bending cycles at a 2 mm radius. The sensor was successfully integrated into a flexible endoscope, enabling precise shape detection under continuous 360° unidirectional bending, demonstrating feasibility for complex 3D perception. This work addresses long-standing packaging challenges in ultrathin flexible devices and provides a structurally protective strategy for reliable shape sensing in flexible electronic systems.

Indexed as

Equipment DesignRoboticsSiliconHumansSiliconshape sensingsoft roboticsstrain decoupling packagingultrathin silicon

Identifiers

PMID41746163
PMCPMC13088285

What OpenQuestion holds

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LicenceCC BY
Read underepoch 390

Registered trials

None linked

Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.