Evidence map›Paper›PMID 41703991›Full record

ArticleAdvanced science (Weinheim, Baden-Wurttemberg, Germany)2026

Thermally Induced Creep and Viscoelastic Behavior of Copper Micropillar Arrays.

Miao Wang, Jihua Zhang, Libin Gao, Hongwei Chen, Wenbo Luo, Wenlei Li, Mingcheng Chen, Mengru Li, Dongbin Wang, Shuang Li and 5 more

Abstract read
PubMed Full text at PMC Publisher
In one paragraph

Article in Advanced science (Weinheim, Baden-Wurttemberg, Germany), 2026. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Not yet cited in PubMed.

0numbers the graph read from it
0cells of the map it votes in
0citing papers in PubMed
–field-weighted citation impact
1 · What the graph read from it

What it found

Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.

The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.

2 · The registry

The trial behind it

Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.

Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.

3 · Its place in the literature

Who cites it

0 citing papers in PubMed.

No citing paper in PubMed yet.

4 · The record

Corrections and comments

PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.

5 · Who and what money

Authors and funding

15 authors.

Miao WangState Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, China.
Jihua ZhangState Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, China.ORCID https://orcid.org/0009-0005-5233-8075
Libin GaoState Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, China.
Hongwei ChenState Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, China.
Wenbo LuoState Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, China.
Wenlei LiState Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, China.
Mingcheng ChenState Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, China.
Mengru LiState Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, China.
Dongbin WangResearch and Development Department, 3D Chips (Guangdong) Technology Co., Ltd, Dongguan, China.
Shuang LiResearch and Development Department, 3D Chips (Guangdong) Technology Co., Ltd, Dongguan, China.
Ting LiuResearch and Development Department, 3D Chips (Guangdong) Technology Co., Ltd, Dongguan, China.
Xingzhou CaiResearch and Development Department, 3D Chips (Guangdong) Technology Co., Ltd, Dongguan, China.
Yong LiResearch and Development Department, Chengdu Micro-Technology Co. Ltd, Chengdu, China.
Bin PengState Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, China.
Wanli ZhangState Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, China.

Funding

Dongguan Key Research and Development Program 20221200300092National Key Research and Development Program 2023YFB4606800Shenzhen Science and Technology Innovation Bureau KJZD20240903104002004
6 · The paper itself

Abstract

Copper micropillar arrays integrated in microchannel structures promise superior heat dissipation, yet their long-term reliability can be limited by creep deformation under thermomechanical constraints. Here, we fabricate Cu micropillar arrays (∼50 µm in diameter and ∼300 µm in height) via electrodeposition within through-glass vias (TGVs) and elucidate how heat treatment tailors creep, viscoelastic response, and deformation mechanisms. Nanoindentation creep combined with EBSD and TEM reveals the transition: 200°C promotes grain-boundary-mediated deformation with the largest creep displacement (101 nm) and the smallest activation volume (0.64 nm

Indexed as

copper micropillar arrayscreep behaviormicrostructure evolutionnano‐indentationthermal conductivity performance

Identifiers

PMID41703991
PMCPMC13088336

What OpenQuestion holds

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Registered trials

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Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.