Evidence map›Paper›PMID 41698048›Full record

ReviewAdvanced science (Weinheim, Baden-Wurttemberg, Germany)2026

Emerging Advanced Electronic Packaging Materials for Thermal Management in Power Electronics.

Yongjun Huo, Jiaqi Song, Wenqian Li, Jian Zhang, Yujin Zhang, Yang Fu, Wangchao Yuan, Xin Chen, Sichen Liu, Miao Jiang and 2 more

Abstract readReview
PubMed Full text at PMC Publisher
In one paragraph

Review in Advanced science (Weinheim, Baden-Wurttemberg, Germany), 2026. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 1 paper.

0numbers the graph read from it
0cells of the map it votes in
1citing papers in PubMed
–field-weighted citation impact
1 · What the graph read from it

What it found

Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.

The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.

2 · The registry

The trial behind it

Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.

Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.

3 · Its place in the literature

Who cites it

1 citing paper in PubMed.

  1. Article
4 · The record

Corrections and comments

PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.

5 · Who and what money

Authors and funding

12 authors.

Yongjun HuoSchool of Materials Science and Engineering, Beijing Institute of Technology, Beijing, China.ORCID https://orcid.org/0000-0001-6367-0501
Jiaqi SongSchool of Materials Science and Engineering, Beijing Institute of Technology, Beijing, China.
Wenqian LiSchool of Materials Science and Engineering, Beijing Institute of Technology, Beijing, China.
Jian ZhangSchool of Materials Science and Engineering, Beijing Institute of Technology, Beijing, China.
Yujin ZhangYangtze Delta Region Academy in Jiaxing, Beijing Institute of Technology, Jiaxing, China.
Yang FuSchool of Materials Science and Engineering, Beijing Institute of Technology, Beijing, China.
Wangchao YuanYangtze Delta Region Academy in Jiaxing, Beijing Institute of Technology, Jiaxing, China.
Xin ChenSchool of Materials Science and Engineering, Beijing Institute of Technology, Beijing, China.
Sichen LiuSchool of Materials Science and Engineering, Beijing Institute of Technology, Beijing, China.
Miao JiangSchool of Materials Science and Engineering, Beijing Institute of Technology, Beijing, China.
Yuan ChengMonash Suzhou Research Institute, Monash University, Suzhou, China.
Gang ZhangSchool of Materials Science and Engineering, Beijing Institute of Technology, Beijing, China.ORCID https://orcid.org/0000-0001-9812-8106

Funding

Beijing Nova Program 20230484280National Natural Science Foundation of China 52473330
6 · The paper itself

Abstract

Current research on integrated circuits and power electronics is rapidly advancing toward miniaturization, high power density, and multi-chip integration, which presents unprecedented challenges to the thermal management performance of packaging materials. Along the device-to-sink heat-flow path in power modules, thermal management relies primarily on two functional material systems: substrate materials that provide mechanical support and electrical insulation, and thermal interface materials (TIMs) that bridge heat transfer across heterogeneous interfaces. This paper summarizes recent advances in thermal management materials for power electronics, with a focus on ceramic-based substrate systems, particularly Si

Indexed as

ceramic substratemultiscale simulationpower electronicsthermal interface materialsthermal management materials

Identifiers

PMID41698048
PMCPMC13042578

What OpenQuestion holds

Textmetadata
LicenceCC BY
Read underepoch 390

Registered trials

None linked

Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.