ArticleMaterials (Basel, Switzerland)2026
Anand Model and Finite Element Analysis of Sn-0.3Ag-0.7Cu-3Bi Lead-Free Solder Joints in BGA Packages.
Article in Materials (Basel, Switzerland), 2026. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Not yet cited in PubMed.
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Abstract
Bi-doped low-silver Sn-Ag-Cu solders are increasingly gaining attention in advanced electronic packaging due to their cost-effectiveness and enhanced mechanical properties. However, the thermo-mechanical reliability mechanisms of such modified solders, particularly Sn-0.3Ag-0.7Cu-3Bi (SAC0307-3Bi) within Ball Grid Array (BGA) assemblies, remain insufficiently understood. To address this gap, this research proposes a comprehensive assessment framework integrating constitutive parameter calibration with finite element analysis (FEA) to accurately characterize the mechanical behavior and fatigue durability of SAC0307-3Bi solder joints under cyclic thermal loads. The Anand viscoplastic parameters were first calibrated via the Norton creep law and virtual tensile tests. Subsequently, a 3D quarter-symmetry model was constructed to replicate thermal cycling conditions between 25 °C and 125 °C. Simulation data reveal a strong correlation between stress concentration and the Distance to Neutral Point (DNP), pinpointing the chip-side interface of the corner joint as the critical failure site. Moreover, creep strain was observed to accrue in a "step-wise" pattern, predominantly during the heating and cooling ramps, reflecting distinct temperature sensitivity. Utilizing the Syed model, the fatigue life was estimated at approximately 2239 cycles. These insights serve as a crucial benchmark for designing robust packages using Bi-doped, low-silver lead-free solders.
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