← Evidence map

ArticleMaterials (Basel, Switzerland)2026

Influence of Pd Coating Thickness and Pd Content in Sn-Based Solders on Interfacial IMC Formation and Microstructural Evolution in Solder/Ni Joints.

Chao-Hong Wang et al.PubMed ↗Full text ↗Publisher ↗

No numbers read from the abstract.

Not cited yet

Full record →Abstract, authors, funding and every citing paper · PMID 41681216