ReviewCommunications engineering2026
Thermal management of 3-D heterogeneously integrated microelectronics: challenges and future research directions.
Review in Communications engineering, 2026. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Not yet cited in PubMed.
What it found
Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.
The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.
The trial behind it
Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.
Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.
Who cites it
0 citing papers in PubMed.
No citing paper in PubMed yet.
Corrections and comments
PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.
Authors and funding
2 authors.
Funding
No grant is acknowledged in the PubMed record.
Abstract
The increasing demand for high-performance computing, artificial intelligence, and advanced communication technologies has accelerated the development of compact, energy-efficient, and multifunctional three-dimensional heterogeneously integrated (3-DHI) microelectronics. While such integrated circuits offer significant improvements in functionality and integration density, the compact and vertical stacking of heterogeneous components introduce significant thermal challenges. These result in non-uniform power densities, hotspot proliferation, thermal expansion mismatch, and narrowing heat dissipation pathways-all of which compromise device reliability, longevity, and performance by hindering heat removal within the package and to the environment. This review critically examines the thermal bottlenecks inherent in 3-DHI architectures and evaluates the effectiveness of current thermal management strategies, including embedded microfluidic cooling, interlayer heat spreaders, and through-silicon vias. Additionally, the article outlines future research directions focused on overcoming existing limitations and advancing the development of thermally efficient 3-DHI chips.
Identifiers
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Registered trials
Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.