Evidence map›Paper›PMID 41605935›Full record

ArticleNature communications2026

A universal all-dry microfabrication method for sensitive electronic materials via an inorganic molecular lithographic mediator.

Cheng Zeng, Yongshan Xu, Xinqi Wei, Jianing Liang, Zongdong Sun, Xiaoyu He, Gaofeng Du, Shuhao Wang, Yao Liu, Xing Zhou and 5 more

Abstract read
In one paragraph

Article in Nature communications, 2026. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Not yet cited in PubMed.

0numbers the graph read from it
0cells of the map it votes in
0citing papers in PubMed
–field-weighted citation impact
1 · What the graph read from it

What it found

Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.

The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.

2 · The registry

The trial behind it

Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.

Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.

3 · Its place in the literature

Who cites it

0 citing papers in PubMed.

No citing paper in PubMed yet.

4 · The record

Corrections and comments

PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.

5 · Who and what money

Authors and funding

15 authors.

Cheng ZengKey Laboratory of Flexible Optoelectronic Materials and Technology (Ministry of Education), School of Optoelectronic Materials & Technology, Jianghan University, Wuhan, China.
Yongshan XuState Key Laboratory of Materials Processing and Die and Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan, China.
Xinqi WeiState Key Laboratory of Materials Processing and Die and Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan, China.
Jianing LiangState Key Laboratory of Materials Processing and Die and Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan, China.
Zongdong SunState Key Laboratory of Materials Processing and Die and Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan, China.
Xiaoyu HeState Key Laboratory of Materials Processing and Die and Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan, China.
Gaofeng DuState Key Laboratory of Materials Processing and Die and Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan, China.
Shuhao WangKey Laboratory of Flexible Optoelectronic Materials and Technology (Ministry of Education), School of Optoelectronic Materials & Technology, Jianghan University, Wuhan, China.
Yao LiuState Key Laboratory of Materials Processing and Die and Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan, China.
Xing ZhouState Key Laboratory of Materials Processing and Die and Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan, China.ORCID http://orcid.org/0000-0001-9031-0130
Yuan LiState Key Laboratory of Materials Processing and Die and Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan, China.ORCID http://orcid.org/0000-0001-7452-1149
Kailang LiuState Key Laboratory of Materials Processing and Die and Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan, China.ORCID http://orcid.org/0009-0005-3374-0720
Ying MaState Key Laboratory of Materials Processing and Die and Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan, China.ORCID http://orcid.org/0000-0002-5649-7410
Tianyou ZhaiState Key Laboratory of Materials Processing and Die and Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan, China. zhaity@hust.edu.cn.ORCID http://orcid.org/0000-0003-0985-4806
Huiqiao LiKey Laboratory of Flexible Optoelectronic Materials and Technology (Ministry of Education), School of Optoelectronic Materials & Technology, Jianghan University, Wuhan, China. hqli@hust.edu.cn.ORCID http://orcid.org/0000-0001-8114-2542

Funding

National Natural Science Foundation of China (National Science Foundation of China) U22A20140
6 · The paper itself

Abstract

Lithography is pivotal in fabricating micro/nanoscale patterns and processing materials for electronic microdevices. However, conventional organic polymeric resists inevitably entail the use of various chemical solutions or solvents, which especially compromise fragile electronic materials featuring atomic-level surfaces. Here, we introduce inorganic selenium molecules as a lithographic mediator for sensitive electronic material processing without direct exposure to solutions or solvents. Specifically, the inorganic selenium molecular film functions as both a lithographic mediator for direct patterning due to its weak intermolecular van der Waals interactions and as a protective encapsulation layer for atomic electronic materials without compromising structural and electronic characteristics. Wafer-scale arrays of sensitive materials with high-quality, sharp edges are facilely achieved by a non-destructive mechanical peeling of the selenium layer. This approach provides a solvent-free lithographic route for microfabricating sensitive materials and high-performance electronic devices.

Identifiers

PMID41605935
PMCPMC12953615

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Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.