ArticleMicromachines2026
Unified Parametric Optimization Framework for Microchannel Fin Geometries in High-Power Processor Cooling.
Article in Micromachines, 2026. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 1 paper.
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The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.
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1 citing paper in PubMed.
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1 author.
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Abstract
This study presents a unified parametric optimization framework for the thermal design of microchannel spreaders used in high-power processor cooling. The fin geometry is expressed in a shape-agnostic parametric form defined by fin thickness, top and bottom gap widths, and channel height, without prescribing a fixed cross-section. This approach accommodates practical fin profiles ranging from rectangular to tapered and V-shaped, allowing continuous geometric optimization within manufacturability and hydraulic limits. A coupled analytical-numerical model integrates conduction through the spreader base, interfacial resistance across the thermal interface material (TIM), and convection within the coolant channels while enforcing a pressure-drop constraint. The optimization uses a deterministic continuation method with smooth sigmoid mappings and penalty functions to maintain constraint satisfaction and stable convergence across the design space. The total thermal resistance (Rtot) is minimized over spreader conductivities ks=400-2200 W m
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