Evidence map›Paper›PMID 41586968›Full record

ArticleNano-micro letters2026

Wafer-Level Self-Assembly and Interface Passivation Patterning Technology for Nanomaterial-Compatible 3D MEMS Sensing Chips.

Zheng Zhang, Yanlin Zhang, Yuanyuan Luo, Guoliang Lv, Jianglin Yin, Pengwei Tan, Guotao Duan

Abstract read
PubMed Full text at PMC Publisher
In one paragraph

Article in Nano-micro letters, 2026. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 2 papers.

0numbers the graph read from it
0cells of the map it votes in
2citing papers in PubMed
–field-weighted citation impact
1 · What the graph read from it

What it found

Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.

The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.

2 · The registry

The trial behind it

Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.

Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.

3 · Its place in the literature

Who cites it

2 citing papers in PubMed.

  1. Stack of BiNano-micro letters · 2026
    Article
  2. Article
4 · The record

Corrections and comments

PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.

5 · Who and what money

Authors and funding

7 authors.

Zheng ZhangSchool of Integrated Circuits, Huazhong University of Science and Technology, Wuhan, 430074, People's Republic of China.
Yanlin ZhangSchool of Integrated Circuits, Huazhong University of Science and Technology, Wuhan, 430074, People's Republic of China.
Yuanyuan LuoKey Laboratory of Materials Physics, Institute of Solid State Physics, HFIPS, Chinese Academy of Sciences, Hefei, 230031, People's Republic of China.
Guoliang LvSchool of Integrated Circuits, Huazhong University of Science and Technology, Wuhan, 430074, People's Republic of China.
Jianglin YinSchool of Integrated Circuits, Huazhong University of Science and Technology, Wuhan, 430074, People's Republic of China.
Pengwei TanSchool of Integrated Circuits, Huazhong University of Science and Technology, Wuhan, 430074, People's Republic of China.
Guotao DuanSchool of Integrated Circuits, Huazhong University of Science and Technology, Wuhan, 430074, People's Republic of China. duangt@hust.edu.cn.

Funding

No grant is acknowledged in the PubMed record.

6 · The paper itself

Abstract

Wafer-scale fabrication of high-performance micro-electro-mechanical systems (MEMS) bio/chemical sensing chips remains constrained by the absence of reliable methods for integrating high-performance nanomaterials into suspended MEMS architectures. Here, a wafer-level manufacturing strategy is presented that redefines the MEMS process flow as "film first, cantilever later." Through kinetically controlled self-assembly, wet-chemically synthesized Pd/SnO

Indexed as

Compatible manufacturingInterface passivation patterning technologyMEMSSensing chipsWafer-level self-assembly

Identifiers

PMID41586968
PMCPMC12834869

What OpenQuestion holds

Textmetadata
Read underepoch 390

Registered trials

None linked

Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.