30 authors.
Zhongqiang Chen *State Key Laboratory of Spintronics, Jiangsu Provincial Key Laboratory of Third Generation Semiconductors and High Energy Efficiency Devices, School of Electronic Science and Engineering, Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, China.
Jin-An Shi *School of Physical Sciences, University of Chinese Academy of Sciences, Beijing, China.
Yuan Chang *MOE Key Laboratory of Materials Modification by Laser, Ion and Electron Beams, Dalian University of Technology, Dalian, China.
Ruijie XuState Key Laboratory of Spintronics, Jiangsu Provincial Key Laboratory of Third Generation Semiconductors and High Energy Efficiency Devices, School of Electronic Science and Engineering, Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, China.
Kankan XuState Key Laboratory of Spintronics, Jiangsu Provincial Key Laboratory of Third Generation Semiconductors and High Energy Efficiency Devices, School of Electronic Science and Engineering, Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, China.
Xu ZhangState Key Laboratory of Spintronics, Jiangsu Provincial Key Laboratory of Third Generation Semiconductors and High Energy Efficiency Devices, School of Electronic Science and Engineering, Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, China.
Xudong LiuState Key Laboratory of Spintronics, Jiangsu Provincial Key Laboratory of Third Generation Semiconductors and High Energy Efficiency Devices, School of Electronic Science and Engineering, Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, China.ORCID http://orcid.org/0000-0003-0500-154X Da TianResearch Institute of Superconductor Electronics, MOE Key Laboratory of Optoelectronic Devices and Systems with Extreme Performances, School of Electronic Science and Engineering, Nanjing University, Nanjing, China.ORCID http://orcid.org/0009-0000-2414-4816 Yong ZhangState Key Laboratory of Spintronics, Jiangsu Provincial Key Laboratory of Third Generation Semiconductors and High Energy Efficiency Devices, School of Electronic Science and Engineering, Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, China.ORCID http://orcid.org/0009-0002-2709-8194 Xingze DaiState Key Laboratory of Spintronics, Jiangsu Provincial Key Laboratory of Third Generation Semiconductors and High Energy Efficiency Devices, School of Electronic Science and Engineering, Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, China.
Gan LiuNational Laboratory of Solid State Microstructures, School of Physics, Nanjing University, Nanjing, China.
Zheng DaiNational Laboratory of Solid State Microstructures, School of Physics, Nanjing University, Nanjing, China.
Yufeng HaoNational Laboratory of Solid State Microstructures, Jiangsu Provincial Key Laboratory of Artificial Functional Materials, College of Engineering and Applied Sciences, Nanjing University, Nanjing, China.ORCID http://orcid.org/0000-0001-7758-5244 Liang HeState Key Laboratory of Spintronics, Jiangsu Provincial Key Laboratory of Third Generation Semiconductors and High Energy Efficiency Devices, School of Electronic Science and Engineering, Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, China.ORCID http://orcid.org/0000-0002-5279-0097 Yongbing XuState Key Laboratory of Spintronics, Jiangsu Provincial Key Laboratory of Third Generation Semiconductors and High Energy Efficiency Devices, School of Electronic Science and Engineering, Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, China.ORCID http://orcid.org/0000-0002-7823-0725 Biaobing JinResearch Institute of Superconductor Electronics, MOE Key Laboratory of Optoelectronic Devices and Systems with Extreme Performances, School of Electronic Science and Engineering, Nanjing University, Nanjing, China.ORCID http://orcid.org/0000-0001-9506-8355 Xinran WangState Key Laboratory of Spintronics, Jiangsu Provincial Key Laboratory of Third Generation Semiconductors and High Energy Efficiency Devices, School of Electronic Science and Engineering, Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, China.ORCID http://orcid.org/0000-0002-3975-1667 Yi ShiState Key Laboratory of Spintronics, Jiangsu Provincial Key Laboratory of Third Generation Semiconductors and High Energy Efficiency Devices, School of Electronic Science and Engineering, Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, China.ORCID http://orcid.org/0000-0002-1082-0315 Rong ZhangState Key Laboratory of Spintronics, Jiangsu Provincial Key Laboratory of Third Generation Semiconductors and High Energy Efficiency Devices, School of Electronic Science and Engineering, Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, China. rzhang@nju.edu.cn.ORCID http://orcid.org/0000-0003-0015-6331 Xuefeng WangState Key Laboratory of Spintronics, Jiangsu Provincial Key Laboratory of Third Generation Semiconductors and High Energy Efficiency Devices, School of Electronic Science and Engineering, Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, China. xfwang@nju.edu.cn.ORCID http://orcid.org/0000-0002-3472-7895