ArticleMaterials (Basel, Switzerland)2025
Structure-Property Relationship in Ultra-Thin Copper Foils: From Nanotwinned to Fine-Grained Microstructures.
Article in Materials (Basel, Switzerland), 2025. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Not yet cited in PubMed.
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Abstract
This study systematically investigates the thickness-dependent mechanical properties of electroplated copper foils with fine-grained (FG-Cu) and columnar nanotwinned (NT-Cu) microstructures. Tensile testing across a thickness range of 5-30 μm revealed that NT-Cu exhibits superior mechanical stability, with significantly lower reductions in both ultimate tensile strength (UTS) and yield strength (YS) compared to FG-Cu. The UTS of the 30 μm thick FG-Cu foil was measured at 651 MPa, increasing to 792 MPa at a thickness of 5 μm. In contrast, the UTS of NT-Cu foils only rose from 624 MPa at 30 μm to 663 MPa at 5 μm. A similar trend was observed for the YS. Microstructural analysis confirmed that NT-Cu maintains a stable columnar grain structure with minimal grain growth, contributing to its resistance to thickness-induced strength loss. These findings highlight NT-Cu as a promising candidate for applications requiring consistent mechanical performance across varying foil thicknesses.
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