14 authors.
Chenyu WangNational Laboratory of Solid State Microstructures, School of Electronic Science and Engineering, College of Engineering and Applied Sciences, School of Physics, and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing 210093, China.ORCID https://orcid.org/0000-0002-9471-0024 Mengwen ChenNational Laboratory of Solid State Microstructures, School of Electronic Science and Engineering, College of Engineering and Applied Sciences, School of Physics, and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing 210093, China.ORCID https://orcid.org/0009-0004-4130-2141 Xiao-Hui TianNational Laboratory of Solid State Microstructures, School of Electronic Science and Engineering, College of Engineering and Applied Sciences, School of Physics, and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing 210093, China.ORCID https://orcid.org/0009-0008-5997-2441 Zishuo GuNational Laboratory of Solid State Microstructures, School of Electronic Science and Engineering, College of Engineering and Applied Sciences, School of Physics, and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing 210093, China.
Jie TangNational Key Laboratory of Solid-State Microwave Devices and Circuits, Nanjing Electronic Devices Institute, Nanjing 210016, China.
Yong ZhangNational Laboratory of Solid State Microstructures, School of Electronic Science and Engineering, College of Engineering and Applied Sciences, School of Physics, and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing 210093, China.ORCID https://orcid.org/0000-0003-1158-2248 Zikang WangNational Laboratory of Solid State Microstructures, School of Electronic Science and Engineering, College of Engineering and Applied Sciences, School of Physics, and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing 210093, China.
Kunpeng JiaNational Laboratory of Solid State Microstructures, School of Electronic Science and Engineering, College of Engineering and Applied Sciences, School of Physics, and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing 210093, China.
Chenyang ShiNational Laboratory of Solid State Microstructures, School of Electronic Science and Engineering, College of Engineering and Applied Sciences, School of Physics, and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing 210093, China.
Guang QianNational Key Laboratory of Solid-State Microwave Devices and Circuits, Nanjing Electronic Devices Institute, Nanjing 210016, China.
Zhenlin WangNational Laboratory of Solid State Microstructures, School of Electronic Science and Engineering, College of Engineering and Applied Sciences, School of Physics, and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing 210093, China.ORCID https://orcid.org/0000-0003-0691-0868 Shi-Ning ZhuNational Laboratory of Solid State Microstructures, School of Electronic Science and Engineering, College of Engineering and Applied Sciences, School of Physics, and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing 210093, China.
Zhenda XieNational Laboratory of Solid State Microstructures, School of Electronic Science and Engineering, College of Engineering and Applied Sciences, School of Physics, and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing 210093, China.ORCID https://orcid.org/0000-0003-2060-3063 No grant is acknowledged in the PubMed record.