ArticleSensors (Basel, Switzerland)2025
Label-Efficient PCB Defect Detection with an ECA-DCN-Lite-BiFPN-CARAFE-Enhanced YOLOv5 and Single-Stage Semi-Supervision.
Article in Sensors (Basel, Switzerland), 2025. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Not yet cited in PubMed.
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Abstract
Printed circuit board (PCB) defect detection is critical to manufacturing quality, yet tiny, low-contrast defects and limited annotations challenge conventional systems. This study develops an ECA-DCN-lite-BiFPN-CARAFE-enhanced YOLOv5 detector by modifying You Only Look Once (YOLO) version 5 (YOLOv5) with Efficient Channel Attention (ECA) for channel re-weighting, a lightweight Deformable Convolution (DCN-lite) for geometric adaptability, a Bi-Directional Feature Pyramid Network (BiFPN) for multi-scale fusion, and Content-Aware ReAssembly of FEatures (CARAFE) for content-aware upsampling. A single-cycle semi-supervised training pipeline is further introduced: a detector trained on labeled images generates high-confidence pseudo-labels for unlabeled data, and the combined set is used for retraining without ratio heuristics. Evaluated on PKU-PCB under label-scarce regimes, the full model improves supervised mean Average Precision at an Intersection-over-Union threshold of 0.5 (mAP@0.5) from 0.870 (baseline) to 0.910, and reaches 0.943 mAP@0.5 with semi-supervision, with consistent class-wise gains and faster convergence. Ablation experiments validate the contribution of each module and identify robust pseudo-label thresholds, while comparisons with recent YOLO variants show favorable accuracy-efficiency trade-offs. These findings indicate that the proposed design delivers accurate, label-efficient PCB inspection suitable for Automated Optical Inspection (AOI) in production environments. This work supports SDG 9 by enhancing intelligent manufacturing systems through reliable, high-precision AI-driven PCB inspection.
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