ArticleMaterials (Basel, Switzerland)2025
Laser-Induced Forward Transfer of Pre-Patterned Solder Paste for High-Aspect-Ratio Deposits.
Article in Materials (Basel, Switzerland), 2025. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Not yet cited in PubMed.
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8 authors.
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Abstract
Precision solder deposition for 3D or flexible substrates remains a persistent challenge in electronic packaging. This study introduces a hybrid process that integrates stencil printing with laser-induced forward transfer (LIFT), employing a customized line-scan trajectory to fabricate high-aspect-ratio solder deposits under large-gap, contactless conditions. Solder paste patterns were first printed on a glass carrier and subsequently transferred using pulsed laser scanning, with high-speed imaging employed to resolve the transfer dynamics. Three transfer regimes-stable, unstable, and no transfer-were identified, with the stable regime exhibiting sequential stages governed by vaporization-induced pressure and the viscoelastic response of the solder paste. The initial aspect ratio (AR) was found to critically influence separation behavior, with AR = 0.3 marking the transition between bridging and cantilevered morphologies. Transferred deposits consistently achieved final aspect ratios approaching 0.7; notably, low-AR (<0.15) patterns showed a 2.2-fold height increase. The process maintains a robust energy window (0.937-1.112 J/cm
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