Applications of Dry Film Photoresist in Micromachining: A Review.

Min Zhang, Funa Meng, Xiaoping Li, Wen Zeng

Abstract readReview

In one paragraph

Review in Micromachines, 2025. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 1 paper.

0numbers the graph read from it

0cells of the map it votes in

1citing papers in PubMed

–field-weighted citation impact

1 · What the graph read from it

What it found

Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.

The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.

2 · The registry

The trial behind it

Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.

Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.

3 · Its place in the literature

Who cites it

1 citing paper in PubMed.

Wet Surface Treatment for Preventing Pattern Collapse of Dry-Film Photoresist in Panel-Level Redistribution Layer Interposer Fabrication.Polymers · 2026
Article

4 · The record

Corrections and comments

PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.

5 · Who and what money

Authors and funding

4 authors.

Min ZhangSchool of Emergency Equipment, North China Institute of Science and Technology, Langfang 065201, China.

Funa MengSchool of Mine Safety, North China Institute of Science and Technology, Langfang 065201, China.

Xiaoping LiSchool of Emergency Equipment, North China Institute of Science and Technology, Langfang 065201, China.

Wen ZengMinistry of Education Key Laboratory of Micro and Nano Systems for Aerospace, School of Mechanical Engineering, Northwestern Polytechnical University, Xi'an 710072, China.

Funding

Central Guidance Foundation for Local Science and Technology Development of China 246Z3706G

6 · The paper itself

Abstract

Dry film photoresist (DFR) is a solid photosensitive resin film that enables multilayer lamination and rapid patterning at relatively low temperatures. Initially developed for the production of printed circuit boards (PCBs), DFR has demonstrated significant application value in the field of micromachining over the past few decades. This paper systematically introduces the structure and lithography mechanism of DFR, provides a broad classification of its applications in micromachining, and focuses on reviewing the latest progress of different applications, including microstructure creation, mould processing, and sacrificial mask fabrication. Furthermore, this article discusses the current challenges encountered by DFR in micromachining at this point, as well as the key areas that warrant further investigation in future research.

Indexed as

DFRmaskmicromachiningmicrostructuremould

Identifiers

PMID41302776

DOI10.3390/mi16111258

PMCPMC12654671

What OpenQuestion holds

Textmetadata

LicenceCC BY

Read underepoch 390

Registered trials

None linked

Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.