ArticleNature communications2025
Efficient thermal management of electronic devices by constructing interlayer phonon bridges.
Article in Nature communications, 2025. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 4 papers.
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Who cites it
4 citing papers in PubMed.
- Visualizing interfacial thermal resistance in two-dimensional material-polymer composites from measurement to mechanistic understanding.Science advances · 2026Review
- Collaborative passive cooling of impact-hardening interfaces enabled by nacre-mimetic design.Nature communications · 2026Article
- Experimental-data-driven thermal conductivity prediction and inverse composition design for alloys.RSC advances · 2026Article
- Designing MOF-Cellulose Bio-Aerogels for Electromagnetic Management and Fire-Acoustic Safety.Research (Washington, D.C.) · 2026Article
Corrections and comments
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Authors and funding
10 authors.
Funding
No grant is acknowledged in the PubMed record.
Abstract
Layered film-based thermal management materials with high in-plane thermal conductivity can effectively diffuse point heat sources and prevent local overheating. However, their low through-plane thermal conductivity limits its overall heat dissipation. Here, we introduce a honeycomb-gel densification strategy that forms zigzag yet continuous interlayer phonon bridges within the layered structure. This design establishes bi-directional thermal pathways, boosting both in-plane and through-plane thermal conductivity by 488.9% and 503.3% of the aramid nanofiber/boron nitride nanosheet, respectively, compared to random-gel densified films. Also, the aramid nanofiber/boron nitride nanosheet film exhibits high solar reflectivity, infrared emissivity, and thermal radiation, enabling efficient subambient cooling (17.2 °C at 100 mW/cm²) for heat-generating devices.
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Registered trials
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