ReviewAdvanced materials (Deerfield Beach, Fla.)2026
Three-Dimensional Interconnect Technologies for Advanced Flexible Electronics.
Review in Advanced materials (Deerfield Beach, Fla.), 2026. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 6 papers.
What it found
Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.
The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.
The trial behind it
Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.
Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.
Who cites it
6 citing papers in PubMed.
- Tailored construction and functional applications of conductive hydrogels for bioelectronic interfaces.Discover nano · 2026Review
- Wearable Electronics for Precision Diagnosis Through Advanced Manufacturing and Integration.Nano-micro letters · 2026Review
- Multilayer Soft PCBs via Laser Patterning and Solvent-Assisted Interface Engineering.Small methods · 2026Article
- Highly integrated, alignment healing, and full-recyclable multifunctional flexible devices based on dynamic covalent bonds.Smart molecules : open access · 2026Article
- Three-dimensional printing of multilayer stretchable electronics with inclined interconnect accesses.Nature communications · 2026Article
- A Review on the Research Progress of Imprint Film Materials for Nanoimprint Lithography.Micromachines · 2026Review
Corrections and comments
PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.
Authors and funding
8 authors.
Funding
Abstract
Flexible electronics have revolutionized wearable devices, soft robotics, and human-machine interfaces, yet conventional 2D architectures face inherent limitations in integration density and performance. 3D integration emerges as a transformative solution, enabling vertical stacking of functional layers to achieve miniaturization, improved signal integrity, and heterogeneous system integration. Despite these benefits, critical challenges remain in developing reliable 3D interconnect technologies for flexible systems, including the need for stretchable and highly conductive materials, robust fabrication processes for multilayer integration, and solutions to mitigate interfacial stress and signal crosstalk. This review systematically examines recent advancements in 3D flexible interconnects, covering material innovations, fabrication techniques, rigid-flex integration strategies, and crosstalk suppression approaches. Representative applications of 3D flexible electronics are further highlighted and future research directions are discussed to advance this promising field.
Indexed as
Identifiers
What OpenQuestion holds
Registered trials
Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.