ArticleJournal of orthodontic science2025
Comparative assessment of shear bond strength and adhesive remnant scores of orthodontic adhesive containing copper-substituted hydroxyapatite nanoparticles with conventional orthodontic adhesive: An
Article in Journal of orthodontic science, 2025. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Not yet cited in PubMed.
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4 authors.
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Abstract
backgroundAn ideal orthodontic adhesive should provide a bond strong enough to withstand the forces of orthodontic treatment and mastication without dislodging, while also being safe enough to prevent surface damage debonding. Shear bond strength (SBS) is a critical factor that determines the quality of bonding in orthodontics. Nanoparticle-enhanced adhesives have been reported to offer additional benefits such as antimicrobial properties and remineralization effects, making them worth investigating for their shear bond characteristics. Aim: This MATERIALS AND
methodsTwenty-eight extracted human premolar teeth were randomly divided into two groups of 14. In Group 1, orthodontic brackets were bonded using Enlight adhesive mixed with Cu-HA nanoparticles, while Group 2 used conventional Enlight adhesive. SBS was measured using a Universal Testing Machine, and the debonded samples were evaluated for ARI scores under scanning electron microscopy (SEM). Statistical analyses were performed using independent
resultsThe group using Enlight adhesive with Cu nanoparticles exhibited a significantly higher mean SBS (9.03 ± 6.17 MPa) compared to the conventional adhesive group (5.51 ± 2.099 MPa,
conclusionCopper-substituted hydroxyapatite nanoparticles enhance bond strength and adhesive retention, making them a promising alternative to conventional adhesives in orthodontics. CLINICAL RELEVANCE: The findings indicate that adhesives containing Cu-HA nanoparticles, especially when combined with the Enlight adhesive, offer superior bond strength and adhesive retention compared to conventional adhesives. This could lead to improved clinical outcomes in orthodontic bonding, potentially reducing bracket failure rates and enhancing treatment efficiency.
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