Evidence map›Paper›PMID 41156402›Full record

ArticleMicromachines2025

Post Wire-Bonding Corrosion Prevention Strategies to Mitigate Chloride- and Bromide-Induced Corrosion Failures in Cu- and PCC-Based Wire-Bonded Packages.

Dinesh Kumar Kumaravel, Shinoj Sridharan Nair, Khanh Tuyet Anh Tran, Pavan Ahluwalia, Kevin Antony Jesu Durai, Oliver Chyan

Abstract read
PubMed Full text at PMC Publisher
In one paragraph

Article in Micromachines, 2025. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 2 papers.

0numbers the graph read from it
0cells of the map it votes in
2citing papers in PubMed
–field-weighted citation impact
1 · What the graph read from it

What it found

Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.

The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.

2 · The registry

The trial behind it

Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.

Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.

3 · Its place in the literature

Who cites it

2 citing papers in PubMed.

  1. Article
  2. Article
4 · The record

Corrections and comments

PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.

5 · Who and what money

Authors and funding

6 authors.

Dinesh Kumar KumaravelDepartment of Chemistry, University of North Texas, Denton, TX 76201, USA.
Shinoj Sridharan NairDepartment of Chemistry, University of North Texas, Denton, TX 76201, USA.ORCID 0000-0002-9868-7992
Khanh Tuyet Anh TranDepartment of Chemistry, University of North Texas, Denton, TX 76201, USA.
Pavan AhluwaliaTexas Academy of Mathematics and Science, University of North Texas, Denton, TX 76201, USA.
Kevin Antony Jesu DuraiDepartment of Chemistry, University of North Texas, Denton, TX 76201, USA.
Oliver ChyanDepartment of Chemistry, University of North Texas, Denton, TX 76201, USA.

Funding

NXP Semiconductors noneUniversity of North Texas none
6 · The paper itself

Abstract

To ensure the highest safety standards in modern automobiles, the industry is constantly adopting zero-defect frameworks, such as AEC-Q100, which aims for defective-parts-per-billion (DPPB) or grade-0 level reliability standards in automotive integrated-circuit (IC) packages. Most contemporary wire-bonded packages use either pure copper (Cu) or palladium (Pd)-coated copper (PCC) wires bonded to aluminum (Al) bond pads as interconnections. This choice is made due to their lower cost and superior electrical and mechanical performance, compared to traditional gold wire-based devices. However, these Cu-Al wire-bonded interconnections are prone to ion-induced lift-off/open-circuit corrosion failures when exposed to even trace amounts (<20 ppm) of extrinsic and/or intrinsic halide (Cl

Indexed as

chloride and bromide corrosionCu and PCC wire bondingLQFP and MAPBGA packagesmetal-selective passivationphosphonic acid–aluminum oxide coordinationreliability failure

Identifiers

PMID41156402
PMCPMC12565955

What OpenQuestion holds

Textmetadata
LicenceCC BY
Read underepoch 390

Registered trials

None linked

Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.