A surface defect detection method for electronic products based on improved YOLOv11.

Traditional manual inspection approaches face challenges due to the reliance on the experience and alertness of operators, which limits their ability to meet the growing demands for efficiency and precision in modern manufacturing processes. Deep learning techniques, particularly in object detection, have shown significant promise for various applications. This paper proposes an improved YOLOv11-based method for surface defect detection in electronic products, aiming to address the limitations of existing YOLO models in handling complex backgrounds and small target defects. By introducing the MD-C2F module, DualConv module, and Inner_MPDIoU loss function, the improved YOLOv11 model has achieved significant improvements in precision, recall rate, detection speed, and other aspects. The improved YOLOv11 model demonstrates notable improvements in performance, with a precision increase from 90.9% to 93.1%, and a recall rate improvement from 77.0% to 84.6%. Furthermore, it shows a 4.6% rise in mAP50, from 84.0% to 88.6%. When compared to earlier YOLO versions such as YOLOv7, YOLOv8, and YOLOv9, the improved YOLOv11 achieves a significantly higher precision of 89.3% in resistor detection, surpassing YOLOv7's 54.3% and YOLOv9's 88.0%. In detecting defects like LED lights and capacitors, the improved YOLOv11 reaches mAP50 values of 77.8% and 85.3%, respectively, both outperforming the other models. Additionally, in the generalization tests conducted on the PKU-Market-PCB dataset, the model's detection accuracy improved from 91.4% to 94.6%, recall from 82.2% to 91.2%, and mAP50 from 91.8% to 95.4%.These findings emphasize that the proposed YOLOv11 model successfully tackles the challenges of detecting small defects in complex backgrounds and across varying scales. It significantly enhances detection accuracy, recall, and generalization ability, offering a dependable automated solution for defect detection in electronic product manufacturing.