Evidence map›Paper›PMID 41149567›Full record

ArticleNanomaterials (Basel, Switzerland)2025

Cu-Contamination-Free Hybrid Bonding via MoS

Hyunbin Choi, Kyungman Kim, Sihoon Son, Dongho Lee, Seongyun Je, Jieun Kang, Sunjae Jeong, Doo San Kim, Minjong Lee, Jiyoung Kim and 1 more

Abstract read
PubMed Full text at PMC Publisher
In one paragraph

Article in Nanomaterials (Basel, Switzerland), 2025. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Not yet cited in PubMed.

0numbers the graph read from it
0cells of the map it votes in
0citing papers in PubMed
–field-weighted citation impact
1 · What the graph read from it

What it found

Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.

The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.

2 · The registry

The trial behind it

Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.

Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.

3 · Its place in the literature

Who cites it

0 citing papers in PubMed.

No citing paper in PubMed yet.

4 · The record

Corrections and comments

PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.

5 · Who and what money

Authors and funding

11 authors.

Hyunbin ChoiDepartment of Semiconductor Convergence Engineering, Sungkyunkwan University, Suwon 16419, Gyeonggi-do, Republic of Korea.
Kyungman KimSKKU Advanced Institute of Nanotechnology (SAINT), Sungkyunkwan University, Suwon 16419, Gyeonggi-do, Republic of Korea.
Sihoon SonSKKU Advanced Institute of Nanotechnology (SAINT), Sungkyunkwan University, Suwon 16419, Gyeonggi-do, Republic of Korea.
Dongho LeeSchool of Mechanical Engineering, Sungkyunkwan University (SKKU), Suwon 16419, Gyeonggi-do, Republic of Korea.
Seongyun JeSKKU Advanced Institute of Nanotechnology (SAINT), Sungkyunkwan University, Suwon 16419, Gyeonggi-do, Republic of Korea.
Jieun KangSchool of Advanced Materials Science and Engineering, Sungkyunkwan University (SKKU), Suwon 16419, Gyeonggi-do, Republic of Korea.
Sunjae JeongDepartment of Display Engineering, Sungkyunkwan University (SKKU), Suwon 16419, Gyeonggi-do, Republic of Korea.
Doo San KimDepartment of Materials Science and Engineering, The University of Texas at Dallas, Richardson, TX 75080, USA.
Minjong LeeDepartment of Electrical and Computer Engineering, The University of Texas at Dallas, Richardson, TX 75080, USA.
Jiyoung KimDepartment of Materials Science and Engineering, The University of Texas at Dallas, Richardson, TX 75080, USA.ORCID 0000-0003-2781-5149
Taesung KimDepartment of Semiconductor Convergence Engineering, Sungkyunkwan University, Suwon 16419, Gyeonggi-do, Republic of Korea.

Funding

No grant is acknowledged in the PubMed record.

6 · The paper itself

Abstract

Hybrid bonding technology has emerged as a critical 3D integration solution for advanced semiconductor packaging, enabling simultaneous bonding of metal interconnects and dielectric materials. However, conventional hybrid bonding processes face significant contamination challenges during O

Indexed as

hybrid bondingpassivation layerPECVDTMD

Identifiers

PMID41149567
PMCPMC12567487

What OpenQuestion holds

Textmetadata
LicenceCC BY
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Registered trials

None linked

Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.