Evidence map›Paper›PMID 41096333›Full record

ArticlePolymers2025

Design of Residual Stress-Balanced Transferable Encapsulation Platform Using Urethane-Based Polymer Superstrate for Reliable Wearable Electronics.

Sung-Hun Jo, Donghwan Kim, Chaewon Park, Eun Gyo Jeong

Abstract read
PubMed Full text at PMC Publisher
In one paragraph

Article in Polymers, 2025. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Not yet cited in PubMed.

0numbers the graph read from it
0cells of the map it votes in
0citing papers in PubMed
–field-weighted citation impact
1 · What the graph read from it

What it found

Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.

The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.

2 · The registry

The trial behind it

Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.

Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.

3 · Its place in the literature

Who cites it

0 citing papers in PubMed.

No citing paper in PubMed yet.

4 · The record

Corrections and comments

PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.

5 · Who and what money

Authors and funding

4 authors.

Sung-Hun JoDivision of System Semiconductor, Dongguk University, Seoul 04620, Republic of Korea.
Donghwan KimDepartment of Electronics Engineering, Incheon National University (INU), 119 Academy-ro, Yeonsu-gu, Incheon 22012, Republic of Korea.
Chaewon ParkDepartment of Electronics Engineering, Incheon National University (INU), 119 Academy-ro, Yeonsu-gu, Incheon 22012, Republic of Korea.
Eun Gyo JeongDepartment of Electronics Engineering, Incheon National University (INU), 119 Academy-ro, Yeonsu-gu, Incheon 22012, Republic of Korea.ORCID 0000-0003-1674-3821

Funding

No grant is acknowledged in the PubMed record.

6 · The paper itself

Abstract

Wearable and skin-mounted electronics demand encapsulation designs that simultaneously provide strong barrier performance, mechanical reliability, and transferability under ultrathin conditions. In this study, a residual stress-balanced transferable encapsulation platform was developed by integrating a urethane-based copolymer superstrate [p(IEM-co-HEMA)] with inorganic thin films. The polymer, deposited via initiated chemical vapor deposition (iCVD), offered over 90% optical transmittance, low RMS roughness (1-3 nm), and excellent solvent resistance, providing a stable base for inorganic barrier integration. An ALD Al

Indexed as

ALD nano-stratified barrieriCVDOLED reliabilitypolymer superstrateresidual stress balancingtransferable encapsulation

Identifiers

PMID41096333
PMCPMC12526734

What OpenQuestion holds

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Registered trials

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Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.