Evidence map›Paper›PMID 41090162›Full record

ArticleRSC advances2025

Electrochemical migration behavior of SnAgCuNi solder alloy in a simulated dew condensation environment.

Luntao Wang, Xuan Liu, Ziheng Zhao, Jialiang Song, Yuxin Shu, Honglun Wang, Yao Tan, Hao Zhang, Heqian Wang, Junsheng Wu and 1 more

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In one paragraph

Article in RSC advances, 2025. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Not yet cited in PubMed.

0numbers the graph read from it
0cells of the map it votes in
0citing papers in PubMed
–field-weighted citation impact
1 · What the graph read from it

What it found

Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.

The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.

2 · The registry

The trial behind it

Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.

Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.

3 · Its place in the literature

Who cites it

0 citing papers in PubMed.

No citing paper in PubMed yet.

4 · The record

Corrections and comments

PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.

5 · Who and what money

Authors and funding

11 authors.

Luntao WangInstitute for Advanced Materials and Technology, University of Science and Technology Beijing Beijing 100083 China xiaokui@ustb.edu.cn.ORCID https://orcid.org/0000-0002-3685-4599
Xuan LiuXiaMen Golden Egret Special Alloy Co., Ltd XiaMen 361007 China.
Ziheng ZhaoInstitute for Advanced Materials and Technology, University of Science and Technology Beijing Beijing 100083 China xiaokui@ustb.edu.cn.
Jialiang SongInstitute for Advanced Materials and Technology, University of Science and Technology Beijing Beijing 100083 China xiaokui@ustb.edu.cn.
Yuxin ShuInstitute for Advanced Materials and Technology, University of Science and Technology Beijing Beijing 100083 China xiaokui@ustb.edu.cn.
Honglun WangXichang Satellite Launch Center Xichang 615000 China.
Yao TanInstitute for Advanced Materials and Technology, University of Science and Technology Beijing Beijing 100083 China xiaokui@ustb.edu.cn.
Hao ZhangInstitute for Advanced Materials and Technology, University of Science and Technology Beijing Beijing 100083 China xiaokui@ustb.edu.cn.
Heqian WangInstitute for Advanced Materials and Technology, University of Science and Technology Beijing Beijing 100083 China xiaokui@ustb.edu.cn.
Junsheng WuInstitute for Advanced Materials and Technology, University of Science and Technology Beijing Beijing 100083 China xiaokui@ustb.edu.cn.
Kui XiaoInstitute for Advanced Materials and Technology, University of Science and Technology Beijing Beijing 100083 China xiaokui@ustb.edu.cn.ORCID https://orcid.org/0000-0002-1172-195X

Funding

No grant is acknowledged in the PubMed record.

6 · The paper itself

Abstract

This study investigates SnAgCuNi lead-free solder alloys, focusing on the electrochemical migration (ECM) failure mechanism under simulated dew condensation conditions. The corrosion characteristics and ECM resistance of the alloys were systematically evaluated. Electrochemical measurements showed that low Ni additions (0.05-0.10 wt%) shifted the corrosion potential positively, reduced the corrosion current density, and significantly increased the charge transfer resistance, indicating improved passivation behavior. The results indicate that the addition of 0.05-0.10 wt% Ni effectively suppresses the ECM reaction rate, reduces ion concentration within the droplet system, mitigates corrosion of the solder alloy, and consequently enhances the ECM resistance of SAC305. In contrast, increasing the Ni content to 0.25 wt% markedly deteriorates ECM resistance. These findings provide a scientific basis and preventive strategies for addressing potential reliability concerns and the risks of metal corrosion migration in electronic packaging.

Identifiers

PMID41090162
PMCPMC12517166

What OpenQuestion holds

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Registered trials

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Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.