Evidence map›Paper›PMID 41089382›Full record

ReviewBurns & trauma2025

Metal semiconductor materials in bone diseases: properties, applications, and future perspectives.

Wenshuang Sun, Yizhang Wu, Jia Sha, Xueru Song, Ziying Sun, Xi Cheng, Tao Yuan, Hong Qian, Xiaojiang Yang, Zhao Tang and 6 more

Abstract readReview
In one paragraph

Review in Burns & trauma, 2025. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 2 papers.

0numbers the graph read from it
0cells of the map it votes in
2citing papers in PubMed
–field-weighted citation impact
1 · What the graph read from it

What it found

Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.

The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.

2 · The registry

The trial behind it

Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.

Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.

3 · Its place in the literature

Who cites it

2 citing papers in PubMed.

  1. Review
  2. Review
4 · The record

Corrections and comments

PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.

5 · Who and what money

Authors and funding

16 authors.

Wenshuang SunDepartment of Orthopedics, Nanjing Jinling Hospital, Affiliated Hospital of Medical School, Nanjing University, No. 305 Zhongshan East Road, Xuanwu District, Nanjing 210002, China.
Yizhang WuDepartment of Applied Physical Sciences, The University of North Carolina at Chapel Hill, 125 south road, Chapel Hill, 27517 North Carolina, United States.ORCID https://orcid.org/0000-0001-6244-8458
Jia ShaDepartment of Orthopedics, Nanjing Jinling Hospital, Affiliated Hospital of Medical School, Nanjing University, No. 305 Zhongshan East Road, Xuanwu District, Nanjing 210002, China.
Xueru SongDepartment of Medical Oncology, Nanjing Jinling Hospital, Affiliated Hospital of Medical School, Nanjing University, No. 305 Zhongshan East Road, Xuanwu District, Nanjing 210000, China.
Ziying SunDepartment of Orthopedics, Nanjing Jinling Hospital, Affiliated Hospital of Medical School, Nanjing University, No. 305 Zhongshan East Road, Xuanwu District, Nanjing 210002, China.
Xi ChengDepartment of Orthopedics, Nanjing Jinling Hospital, Affiliated Hospital of Medical School, Nanjing University, No. 305 Zhongshan East Road, Xuanwu District, Nanjing 210002, China.
Tao YuanDepartment of Orthopedics, Nanjing Jinling Hospital, Affiliated Hospital of Medical School, Nanjing University, No. 305 Zhongshan East Road, Xuanwu District, Nanjing 210002, China.
Hong QianDepartment of Orthopedics, Nanjing Jinling Hospital, Affiliated Hospital of Medical School, Nanjing University, No. 305 Zhongshan East Road, Xuanwu District, Nanjing 210002, China.
Xiaojiang YangDepartment of Orthopedics, Nanjing Jinling Hospital, Affiliated Hospital of Medical School, Nanjing University, No. 305 Zhongshan East Road, Xuanwu District, Nanjing 210002, China.
Zhao TangDepartment of Orthopedics, Nanjing Jinling Hospital, Affiliated Hospital of Medical School, Nanjing University, No. 305 Zhongshan East Road, Xuanwu District, Nanjing 210002, China.
Yueying ChenDepartment of Orthopedics, Nanjing Jinling Hospital, Affiliated Hospital of Medical School, Nanjing University, No. 305 Zhongshan East Road, Xuanwu District, Nanjing 210002, China.
Xinrui SunDepartment of Orthopedics, Nanjing Jinling Hospital, Affiliated Hospital of Medical School, Nanjing University, No. 305 Zhongshan East Road, Xuanwu District, Nanjing 210002, China.
Liang WangDepartment of Orthopedics, the 902nd Hospital of PLA Joint Logistic Support Force, No. 1052 Yanshan Road, Yuhui District, Bengbu, Anhui Province, China.
Jia MengDepartment of Orthopedics, Nanjing Jinling Hospital, Affiliated Hospital of Medical School, Nanjing University, No. 305 Zhongshan East Road, Xuanwu District, Nanjing 210002, China.
Zhongyang LvDepartment of Orthopedics, Nanjing Jinling Hospital, Affiliated Hospital of Medical School, Nanjing University, No. 305 Zhongshan East Road, Xuanwu District, Nanjing 210002, China.ORCID https://orcid.org/0009-0003-1796-6979
Nirong BaoDepartment of Orthopedics, Nanjing Jinling Hospital, Affiliated Hospital of Medical School, Nanjing University, No. 305 Zhongshan East Road, Xuanwu District, Nanjing 210002, China.

Funding

No grant is acknowledged in the PubMed record.

6 · The paper itself

Abstract

The objective of bone tissue engineering is to develop innovative biomaterials and stimulation strategies to promote bone regeneration. Bioelectric materials play a crucial role in this domain owing to their inspiration of the inherent piezoelectric properties of bone. This review explores the progress made in utilizing metal semiconductor materials for bone tissue engineering, focusing on their operating mechanisms, various material classifications, and the ways they foster bone regeneration. First, the working principles of metal semiconductor materials are discussed, with an emphasis on the importance of bioelectric phenomena in regulating cell behavior. Owing to their roles in mimicking the electrophysiological microenvironment to promote bone regeneration, we highlight various types of metal semiconductor materials, such as metallic semiconductor materials, piezoelectric materials, and conductive biomaterials. Personalized and specific materials, including conductive smart scaffolds, modified implant surfaces, and those that target bone tissues, promote osseointegration and exert antibacterial properties, serving diverse applications in bone tissue engineering. Additionally, to improve implant biocompatibility and osseointegration, the use of metal semiconductor materials in the design of orthopedic implants has shown promising clinical application prospects. Finally, looking forward to the future applications of metal semiconductor materials in bone engineering, integrating multiple functions, personalized medicine, and biodegradable materials, as well as the application of nanotechnology and 3D printing techniques, may arise to satisfy clinical requirements. This review also presents the biological characteristics of metal semiconductor materials and their recent applications in treating bone diseases, while also discussing innovative concepts for their design and development.

Indexed as

Bone regenerationBone tissue engineeringConductive biomaterialsMetal semiconductor materials

Identifiers

PMID41089382
PMCPMC12516961

What OpenQuestion holds

Textmetadata
LicenceCC BY-NC
Read underepoch 390

Registered trials

None linked

Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.