Evidence map›Paper›PMID 41061071›Full record

ArticleScience advances2025

Three-dimensional shrinking electronics on freestanding and freeform curvilinear surfaces.

Yangbo Yuan, Dongliang Chen, Jianyu Li, Bowen Li, Abu Musa Abdullah, Fatema Tuz Zohra, Wanqing Zhang, Xianzhe Zhang, Xin Xin, Mohammad Ali Amidian and 3 more

Abstract read
PubMed Full text at PMC Publisher
In one paragraph

Article in Science advances, 2025. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 1 paper.

0numbers the graph read from it
0cells of the map it votes in
1citing papers in PubMed
–field-weighted citation impact
1 · What the graph read from it

What it found

Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.

The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.

2 · The registry

The trial behind it

Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.

Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.

3 · Its place in the literature

Who cites it

1 citing paper in PubMed.

  1. Review
4 · The record

Corrections and comments

PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.

5 · Who and what money

Authors and funding

13 authors.

Yangbo YuanDepartment of Engineering Science and Mechanics, The Pennsylvania State University, University Park, PA 16802, USA.ORCID 0000-0001-5505-7002
Dongliang ChenJohn and Willie Leone Family Department of Energy and Mineral Engineering, The Pennsylvania State University, University Park, PA 16802, USA.ORCID 0000-0002-9439-7453
Jianyu LiJohn and Willie Leone Family Department of Energy and Mineral Engineering, The Pennsylvania State University, University Park, PA 16802, USA.ORCID 0009-0001-8796-7681
Bowen LiDepartment of Engineering Science and Mechanics, The Pennsylvania State University, University Park, PA 16802, USA.ORCID 0000-0003-4893-0525
Abu Musa AbdullahDepartment of Engineering Science and Mechanics, The Pennsylvania State University, University Park, PA 16802, USA.
Fatema Tuz ZohraDepartment of Engineering Science and Mechanics, The Pennsylvania State University, University Park, PA 16802, USA.ORCID 0009-0009-8153-9510
Wanqing ZhangDepartment of Engineering Science and Mechanics, The Pennsylvania State University, University Park, PA 16802, USA.ORCID 0000-0002-7298-5983
Xianzhe ZhangDepartment of Engineering Science and Mechanics, The Pennsylvania State University, University Park, PA 16802, USA.
Xin XinDepartment of Engineering Science and Mechanics, The Pennsylvania State University, University Park, PA 16802, USA.
Mohammad Ali AmidianDepartment of Engineering Science and Mechanics, The Pennsylvania State University, University Park, PA 16802, USA.
Ankan DuttaDepartment of Mechanical Engineering, The Pennsylvania State University, University Park, PA 16803, USA.ORCID 0000-0002-7572-5431
Feifei ShiJohn and Willie Leone Family Department of Energy and Mineral Engineering, The Pennsylvania State University, University Park, PA 16802, USA.ORCID 0000-0002-2598-1867
Huanyu ChengDepartment of Engineering Science and Mechanics, The Pennsylvania State University, University Park, PA 16802, USA.ORCID 0000-0001-6075-4208

Funding

No grant is acknowledged in the PubMed record.

6 · The paper itself

Abstract

Wearable electronics that adapt to three-dimensional (3D) surfaces are essential for next-generation smart internet of things (IoT), yet existing strategies remain limited because of fabrication complexity, material incompatibility, or poor structural control. Here, this work introduces a scalable yet versatile approach to design and fabricate 3D electronic systems by printing liquid metal patterns onto heat-shrinkable polymer substrates. Upon controlled thermal actuation, the 2D circuits transform into target 3D geometries with enhanced electrical performance. The resulting 3D shrinking electronics enable conformal antenna integration for IoT devices and gesture-interactive wearable interfaces. This low-cost, versatile platform offers a paradigm for customizable, shape-adaptive electronics in intelligent real and virtual environments.

Identifiers

PMID41061071
PMCPMC13155639

What OpenQuestion holds

Textmetadata
LicenceCC BY-NC
Read underepoch 390

Registered trials

None linked

Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.