ArticleIEEE transactions on electron devices2025
Modeling of Conduction Mechanism in Filament-free Multi-layer Bulk RRAM.
Article in IEEE transactions on electron devices, 2025. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 1 paper.
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1 citing paper in PubMed.
- A Study on the Synaptic Behavior of Al/ZrOACS applied materials & interfaces · 2025Article
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8 authors.
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Abstract
Filament-free bulk RRAM (resistive-switching random access memory) devices have been proposed to offer multi-level conductance states with less variations and noise and forming-free operation for neuromorphic computing applications. Understanding conduction mechanism and switching dynamics of filament-free bulk RRAM devices is crucial to optimize device characteristics and to build large-scale arrays for compute in memory and neuromorphic computing applications. Here, we first analyze switching characteristics of bulk RRAM by temperature dependent I-V measurements. We then present a quantitative physical model describing the conduction across trilayer stack by a series combination of multiple conduction mechanisms across each layer. Using this model and fitting it to the experimental characteristics of filament-free bulk RRAM devices, we investigate the origin of bulk switching in trilayer stacks. We demonstrate that our model can be used as a guide to design bulk switching RRAM devices from multilayer stacks of metal oxides.
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