ArticleACS applied electronic materials2025
Fast and Cost-Effective Fabrication of Ultrathin (20 μm) Silicon Substrates by Melt-Spinning.
Article in ACS applied electronic materials, 2025. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Not yet cited in PubMed.
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Abstract
Thin silicon wafer fabrication is a crucial aspect of semiconductor manufacturing, offering enhanced material yield and reduced fabrication costs. Traditional techniques for producing thin silicon substrates often involve the use of supporting substrates for bonding/debonding or intricate processes, such as etching and thinning. In this study, we present the fabrication of an ultrathin polycrystalline silicon substrate utilizing a melt-spinner approach. Our approach has yielded a substrate of unprecedented dimensions, characterized by a width of 1 cm, a length of 5 cm, and an approximate thickness of 20 μm, and fabricated at a speed of 35 m s
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