ArticleMicromachines2025
Structure and Temperature Dependence of Solder Layer and Electric Parameters in IGBT Modules.
Article in Micromachines, 2025. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 2 papers.
What it found
Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.
The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.
The trial behind it
Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.
Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.
Who cites it
2 citing papers in PubMed.
- Thermal/Mechanical Characteristics Simulation Analysis of Solder Layer Damage in IGBT Modules.Micromachines · 2026Article
- A New Approach to the Synthesis of Micron-Sized Single-Crystal Silver Plates.Micromachines · 2025Article
Corrections and comments
PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.
Authors and funding
4 authors.
Funding
Abstract
IGBT high-power devices are subjected to various extreme working conditions for long periods and are affected by multiple loading conditions, inevitably leading to various aging and failure issues. Among them, the solder layer, as one of the weakest parts in the packaging structure of IGBT modules, has rarely been studied regarding its thermal fatigue characteristics and interface structure evolution behavior. In this work, a rapid temperature test chamber was used to conduct a thermal fatigue temperature cycling experiment on IGBT modules from -40 to 150 °C. The microscopic structural evolution behavior and the growth pattern of intermetallic compounds (IMC) during the solder layer's thermal fatigue process of the IGBT modules were studied. At the same time, the changes in relevant static parameters of the IGBT after thermal cycling fatigue were tested using an oscilloscope and a power device analyzer, thereby clarifying the failure mechanism of the IGBT module. This provides a theoretical basis and data support for the thermal design and reliability assessment of IGBT modules.
Indexed as
Identifiers
What OpenQuestion holds
Registered trials
Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.