ReviewMicromachines2025
Assembly and Interconnection Technologies for 3D Plastic Circuit Carriers: An Overview of Technologies, Materials, and Applications.
Review in Micromachines, 2025. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 1 paper.
What it found
Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.
The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.
The trial behind it
Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.
Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.
Who cites it
1 citing paper in PubMed.
Corrections and comments
PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.
Authors and funding
7 authors.
Funding
Abstract
This paper aims to present an overview of the state-of-the-art materials and technologies that can be used to create electronic circuits on 3D plastic carriers also known as 3D electronics. Strategies for print-based and laser-based 3D electronics will be discussed as well as the techniques to apply the circuit carrier and the way interconnection technology can be used to combine electronic components on top of the circuit carrier. A basic explanation of the functional principles, materials, and applications is given for different substrate and interconnection technologies. The aim is to make it easier to compare different technologies and its required materials to make the right decisions on what technology is best suited for the job. For this purpose, comparison tables for 3D plastic circuit carrier technologies and substrate materials considering their temperature stability were created. It can be concluded that there are a lot of influencing factors that determine which technologies are best suited for application. The most important factors are the 3D complexity and the field of application, the required structure size of the circuit, and the required production quantity.
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Registered trials
Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.