Molecular Dynamics Study on Silane Coupling Agent Grafting to Optimize the Interfacial Microstructure and Physical Properties of Polyimide/Nano-Si

Qikun Yang, Jinxin Huang, Li Zhang, Nurbek N Kurbonov, Shengrui Zhou

Abstract read

In one paragraph

Article in Materials (Basel, Switzerland), 2025. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 1 paper.

0numbers the graph read from it

0cells of the map it votes in

1citing papers in PubMed

–field-weighted citation impact

1 · What the graph read from it

What it found

Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.

The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.

2 · The registry

The trial behind it

Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.

Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.

3 · Its place in the literature

Who cites it

1 citing paper in PubMed.

Preparation and Application of Macromolecular Silane Coupling Agent for Polyimide-Based Composites.Materials (Basel, Switzerland) · 2026
Article

4 · The record

Corrections and comments

PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.

5 · Who and what money

Authors and funding

5 authors.

Qikun YangSchool of Electrical Engineering, Shandong University, Jinan 250061, China.

Jinxin HuangSchool of Continuing Education, Shandong University, Jinan 250100, China.

Li ZhangSchool of Electrical Engineering, Shandong University, Jinan 250061, China.

Nurbek N KurbonovFaculty of Electrical Power Engineering, Tashkent State Technical University, Tashkent 100095, Uzbekistan.ORCID 0009-0006-5400-3532

Shengrui ZhouSchool of Electrical Engineering, Shandong University, Jinan 250061, China.

Funding

the National Natural Science Foundation of China 52477145

6 · The paper itself

Abstract

Polyimide (PI) is widely used in aerospace, electronic packaging, and other fields due to its excellent dielectric and thermophysical properties. However, the performance of traditional PI materials under extreme conditions has become increasingly inadequate to meet the growing demands. To address this, this study designed a PI/Nano-Si

Indexed as

microstructuresmolecular dynamicspolymer compositessilane coupling agentthermophysical properties

Identifiers

PMID41010269

DOI10.3390/ma18184425

PMCPMC12471746

What OpenQuestion holds

Textmetadata

LicenceCC BY

Read underepoch 390

Registered trials

None linked

Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.