Evidence map›Paper›PMID 40962872›Full record

ArticleNature nanotechnology2025

Molecular crystal memristors.

Lanhao Qin, Pengfei Guan, Jiefan Shao, Yu Xiao, Yimeng Yu, Jie Su, Conghui Zhang, Yanyong Li, Shenghong Liu, Pengyu Li and 14 more

Abstract read
PubMed Publisher
In one paragraph

Article in Nature nanotechnology, 2025. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 12 papers.

0numbers the graph read from it
0cells of the map it votes in
12citing papers in PubMed
–field-weighted citation impact
1 · What the graph read from it

What it found

Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.

The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.

2 · The registry

The trial behind it

Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.

Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.

3 · Its place in the literature

Who cites it

12 citing papers in PubMed.

  1. Lattice Disorder in CuI Enables Filament-Free Transparent Memristors.Advanced science (Weinheim, Baden-Wurttemberg, Germany) · 2026
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4 · The record

Corrections and comments

PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.

5 · Who and what money

Authors and funding

24 authors.

Lanhao Qin *State Key Laboratory of Materials Processing and Die and Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan, China.
Pengfei Guan *State Key Laboratory of Materials Processing and Die and Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan, China.
Jiefan Shao *State Key Laboratory of Materials Processing and Die and Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan, China.
Yu XiaoCollege of Computer Science and Technology, State Key Laboratory of Brain Machine Intelligence, Zhejiang University, Hangzhou, China.ORCID http://orcid.org/0009-0009-2292-6588
Yimeng YuState Key Laboratory of Advanced Technology for Materials Synthesis and Processing, Wuhan University of Technology, Wuhan, China.
Jie SuCenter of Hydrogen Science, State Key Laboratory of Metal Matrix Composites, School of Materials Science and Engineering, Innovation Center for Future Materials, Shanghai Jiao Tong University, Shanghai, China.
Conghui ZhangSchool of Materials Science and Engineering, Zhengzhou University, Zhengzhou, China.
Yanyong LiSchool of Materials Science and Engineering, Zhengzhou University, Zhengzhou, China.
Shenghong LiuState Key Laboratory of Materials Processing and Die and Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan, China.
Pengyu LiState Key Laboratory of Materials Processing and Die and Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan, China.
Decai OuyangState Key Laboratory of Materials Processing and Die and Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan, China.
Wenke HeState Key Laboratory of Materials Processing and Die and Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan, China.
Fenghao LiuCollege of Computer Science and Technology, State Key Laboratory of Brain Machine Intelligence, Zhejiang University, Hangzhou, China.
Kaichen ZhuMaterials Science and Engineering Program, Physical Science and Engineering Division, King Abdullah University of Science and Technology (KAUST), Thuwal, Saudi Arabia.ORCID http://orcid.org/0000-0003-1195-8751
Kailang LiuState Key Laboratory of Materials Processing and Die and Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan, China.
Zhenpeng YaoCenter of Hydrogen Science, State Key Laboratory of Metal Matrix Composites, School of Materials Science and Engineering, Innovation Center for Future Materials, Shanghai Jiao Tong University, Shanghai, China.
Jinsong WuState Key Laboratory of Advanced Technology for Materials Synthesis and Processing, Wuhan University of Technology, Wuhan, China.ORCID http://orcid.org/0000-0002-7305-7927
Yinghe ZhaoState Key Laboratory of Materials Processing and Die and Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan, China.
Huiqiao LiState Key Laboratory of Materials Processing and Die and Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan, China.ORCID http://orcid.org/0000-0001-8114-2542
Fei HuiSchool of Materials Science and Engineering, Zhengzhou University, Zhengzhou, China.ORCID http://orcid.org/0000-0001-6609-6189
Peng LinCollege of Computer Science and Technology, State Key Laboratory of Brain Machine Intelligence, Zhejiang University, Hangzhou, China.ORCID http://orcid.org/0000-0002-0679-8063
Mario LanzaMaterials Science and Engineering Program, Physical Science and Engineering Division, King Abdullah University of Science and Technology (KAUST), Thuwal, Saudi Arabia.ORCID http://orcid.org/0000-0003-4756-8632
Yuan LiState Key Laboratory of Materials Processing and Die and Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan, China. yuanli1@hust.edu.cn.ORCID http://orcid.org/0000-0001-7452-1149
Tianyou ZhaiState Key Laboratory of Materials Processing and Die and Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan, China. zhaity@hust.edu.cn.ORCID http://orcid.org/0000-0003-0985-4806

Funding

No grant is acknowledged in the PubMed record.

6 · The paper itself

Abstract

Memristors have emerged as a promising hardware platform for in-memory computing, but many current devices suffer from channel material degradation during repeated resistive switching. This leads to high energy consumption and limited endurance. Here we introduce a molecular crystal memristor, of which the representative channel material, Sb

Identifiers

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Registered trials

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Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.